Fan-Out Image Sensor Package With Redistribution Layer Integration
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Solution Overview
Problem
Existing chip package structures for CMOS image sensors and image signal processors are bulky due to the presence of an interposer and printed circuit board, hindering the development of small volume and high density packaging.
Innovation Solution
A fan-out package structure for image sensing devices is introduced, comprising an image sensing unit with a spacer layer and light-transmitting cover plate, a redistribution layer that eliminates the need for an interposer, and an encapsulation layer that exposes the light-transmitting cover plate, allowing for direct connection of the image signal processor and conductive elements via through-silicon vias and conductive vias, respectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer and printed circuit board are used to combine CMOS image sensor and image signal processor, then the components can be connected and protected, but the package volume becomes large
Solution Approach 1:
The patent merges the interposer and printed circuit board functions into a single redistribution layer structure. The redistribution layer is formed directly on the substrate, eliminating the need for separate interposer and PCB components, thereby reducing overall package volume while maintaining electrical connection reliability between the CMOS image sensor and image signal processor
Solution Approach 2:
The patent extracts and eliminates the interposer component from the traditional package structure. By forming the redistribution layer directly on the substrate without requiring an interposer, the design achieves volume reduction while still providing the necessary electrical interconnection and protection functions
2Ease of manufacture
If traditional chip package structure with interposer and printed circuit board is used, then components can be assembled, but the package cannot achieve high density
Solution Approach 1:
The patent combines multiple functions (interconnection, protection, signal routing) into the redistribution layer, eliminating the need for separate interposer and PCB layers. This merging enables higher component density by reducing the vertical stacking of components while maintaining assembly feasibility through a streamlined manufacturing process
Solution Approach 2:
The patent transitions from a vertical stacking architecture (multiple layers of interposer and PCB) to a planar redistribution layer approach. By distributing connections horizontally across the substrate surface rather than vertically through multiple stacked components, the design achieves higher component density while preserving manufacturability
Data Source
AI summary
A fan-out package structure of an image sensing device includes an image sensing unit having an image sensor with opposite sensing surface and connecting surface, a spacer layer surrounding a central portion of the sensing surface, and a light-transmitting cover plate disposed on the spacer layer spaced apart from and covering the sensing surface. An image signal processor is disposed on the connecting surface. A redistribution layer covers the image signal processor and the connecting surface, and includes a fan-out area. An encapsulation layer is disposed on the fan-out area, surrounds and covers an outer periphery of the image sensing unit, and allows a top surface of the light-transmitting cover plate to be exposed. A method of manufacturing a fan-out package structure of an image sensing device is also disclosed.