Fan-Out Semiconductor Assembly Using an Intermediate Carrier

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Solution Overview

Problem

Existing semiconductor assembly processes face challenges in efficiently forming fan-out and fan-in assembly structures with high precision and throughput, particularly in handling thin and fragile components, while ensuring structural support and electrical connectivity.

Innovation Solution

The method involves using intermediate carriers to mount components with conductive studs, encapsulating them with a temporary carrier, and forming a reconstituted panel with a planar surface, followed by applying fan-in or fan-out build-up interconnect structures, and removing the temporary carrier to achieve a thin, structurally supported assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If intermediate carriers are used to mount thin components, then structural support and reduced component breakage are improved, but device complexity increases

Engineering Contradiction:

Improvestructural supportVSAvoiddevice complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The patent introduces intermediate carriers as mediator elements between the temporary carrier and the thin semiconductor components. These intermediate carriers provide the necessary structural support and mechanical strength to handle fragile components during assembly, while being removable after encapsulation. This resolves the contradiction by adding a temporary intermediary structure that enables strong structural support without permanently increasing device complexity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The carrier system is segmented into multiple functional layers: temporary carrier for initial support, intermediate carriers for component mounting and structural reinforcement, and the final encapsulated assembly. This segmentation allows each layer to serve its specific purpose - the intermediate carriers can be optimized for structural support during manufacturing then removed, avoiding permanent complexity in the final device.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If intermediate carriers are used to mount components, then manufacturing precision is improved, but ease of manufacture deteriorates

Engineering Contradiction:

ImproveprecisionVSAvoidease of manufacture

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The intermediate carriers act as intermediary mounting platforms that provide precise positioning features for components. They include alignment structures and mounting sites that enable high-precision component placement. After encapsulation, these intermediate carriers are removed, having served their precision manufacturing purpose without permanently complicating the manufacturing process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If encapsulant is disposed over intermediate carriers and components, then reliability is improved through structural support, but loss of substance increases due to encapsulant material

Engineering Contradiction:

ImprovereliabilityVSAvoidloss of substance

Core Design Contradiction:

ReliabilityVSLoss of substance

Solution Approach 1:

The intermediate carriers provide beforehand cushioning and structural support during the encapsulation process, distributing mechanical stresses and protecting the thin components from damage. This allows the use of encapsulant material that adequately protects components without requiring excessive amounts, as the intermediate carriers prevent component breakage that would otherwise necessitate over-encapsulation.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

4Productivity

If fan-out and fan-in assembly structures are formed with thin components, then productivity is improved through high-speed placement, but manufacturing precision deteriorates due to component fragility

Engineering Contradiction:

ImprovethroughputVSAvoidprecision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The intermediate carriers serve as stable intermediary platforms that enable high-speed automated pick-and-place operations for thin components. The carriers provide rigid support during rapid component placement, preventing fragility-related positioning errors. After assembly completion, the intermediate carriers are removed, having enabled both high productivity and manufacturing precision during the assembly process.

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20250336888A1Method of making a fan-out semiconductor assembly with an intermediate carrier

Publication Date: 2025.10.30 DECA TECH USA INC

AI summary

A semiconductor assembly comprising an intermediate carrier which is not an interposer and does not comprise electrical routing in or on the intermediate carrier, a plurality of components disposed over the intermediate carrier such that an active surface of the plurality of components is oriented away from the intermediate carrier, where the plurality of components have a thickness in a range of 2-500 micrometers (μm) and one or more components comprise conductive studs disposed over a front surface, an encapsulant contacting the intermediate carrier and the plurality of components, where the encapsulant contacts sides of the conductive studs, four side surfaces and the front surface of the plurality of components, and the encapsulant comprises a planar surface above the front surface of the plurality of components, and the planar surface comprises ends of the conductive studs and a planar surface of the encapsulant.