Fan-Out Package Lid Adhesion for Thermal Reliability
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Solution Overview
Problem
Ensuring the reliability of integrated fan-out packages in the semiconductor industry, which face challenges due to their compactness and increased integration density, is a significant technical issue.
Innovation Solution
The method involves forming a semiconductor device with a package substrate, a package component, and an adhesive pattern, where the package component is bonded to the substrate, and a heat dissipation lid is attached using an adhesive layer and patterns that provide enhanced thermal dissipation and mechanical support, preventing delamination and improving coverage of the thermal interface material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integrated fan-out packages are made more compact to increase integration density, then more components can be integrated into a given area, but reliability becomes harder to ensure due to increased stress and thermal challenges
Solution Approach 1:
The patent divides the package structure into distinct functional layers including a substrate, adhesive patterns, thermal interface material, and heat dissipation lid. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall package integrity and reliability despite high integration density
Solution Approach 2:
The patent introduces adhesive patterns as intermediary elements between the substrate and heat dissipation lid. These adhesive patterns serve as mediators that provide both mechanical bonding and thermal conduction pathways, ensuring reliability in compact packages by distributing stress and improving thermal transfer at critical interfaces
2Reliability
If adhesive patterns are added to improve adhesion between heat dissipation lid and package substrate, then thermal dissipation and mechanical support are enhanced, but device structure becomes more complex
Solution Approach 1:
The adhesive patterns are designed to perform multiple functions simultaneously: providing mechanical adhesion between the heat dissipation lid and substrate, conducting thermal energy from the package substrate to the lid, and distributing mechanical stresses. This multi-functionality improves reliability without requiring additional separate components, thereby limiting the increase in structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and thermal dissipation of integrated fan-out packages by increasing adhesion between the heat dissipation lid and the package substrate, reducing warpage, and improving the coverage of the thermal interface material, leading to better performance and reduced stress on solder joints.
Implementation Method 1
an adhesive layer and patterns that provide enhanced thermal dissipation
Implementation Method 2
a semiconductor device with a package substrate, a package component, and an adhesive pattern, where the package component is bonded to the substrate, and a heat dissipation lid is attached using an adhesive layer and patterns that provide enhanced thermal dissipation and mechanical support
Data Source
AI summary
A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.