Integrated Fan-Out Redistribution Structure for Overlay Alignment
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Solution Overview
Problem
Integrated fan-out packages face challenges related to compactness and alignment accuracy, which affect the integration density and reliability of electronic components.
Innovation Solution
A manufacturing process for integrated fan-out packages involving a redistribution structure with precise alignment marks and conductive vias, utilizing a carrier with a de-bonding layer and multiple layers of dielectric and conductive materials, along with conductive structures and dies, to enhance alignment and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If integrated fan-out packages use repeated reductions in minimum feature size to improve integration density, then integration density is improved, but alignment accuracy deteriorates
Solution Approach 1:
The patent divides the alignment mark structure into multiple segments including a base layer, intermediate layers, and top layers with different materials and functions. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall alignment accuracy despite feature size reductions
Solution Approach 2:
The patent transitions from two-dimensional alignment marks to three-dimensional multi-layer structures with vertical stacking. This dimensional change provides additional alignment information and redundancy, improving alignment accuracy even as horizontal feature sizes are reduced to increase integration density
2Manufacturing precision
If integrated fan-out packages reduce minimum feature size to improve integration density, then integration density is improved, but package area is reduced
Solution Approach 1:
The patent implements nested multi-layer structures where alignment marks, conductive vias, and dielectric layers are stacked vertically within a compact footprint. This nesting approach maximizes integration density by utilizing the vertical dimension while maintaining a small package area
3Area of stationary object
If integrated fan-out packages use compact designs to reduce package area, then package area is reduced, but alignment failure rate increases
Solution Approach 1:
The patent changes material parameters by using high-k dielectric materials and conductive materials with different resistivities in various layers. These parameter changes enable precise control of electrical and mechanical properties, improving alignment reliability in compact packages
Solution Approach 2:
The patent employs composite structures combining multiple materials including dielectric layers, conductive vias, and alignment mark materials with different physical and electrical properties. This composite approach provides both mechanical stability for alignment and electrical functionality while maintaining compact dimensions
Data Source
AI summary
An integrated fan-out (InFO) package includes a die, an encapsulant laterally encapsulating the die, and a redistribution structure. The redistribution structure is disposed on the encapsulant. The redistribution structure includes a plurality of routing patterns and a plurality of alignment marks. The routing patterns are electrically connected to the die. The alignment marks surround the routing patterns. The alignment marks are electrically insulated from the die and the routing patterns. At least one of the alignment marks is in physical contact with the encapsulant, and the alignment marks located at different level heights are arranged in a non-overlapping manner vertically.