3D Fan-Out Package Structure With Dummy Items for Air Release
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently forming compact and reliable 3D package structures with integrated fan-out (InFO) designs, particularly in ensuring proper de-bonding, encapsulation, and electrical connectivity while preventing issues like air sealing and stress on components during processing.
Innovation Solution
The method involves forming a package structure using a carrier with a de-bonding layer, dielectric layers, conductive vias, and a redistribution layer (RDL) structure, where dummy items are strategically placed to create air paths and prevent air sealing, and passive devices are bonded to the RDL, with encapsulation and singulation processes ensuring component protection and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a compact 3D package structure with InFO design is formed, then integration density and compactness are improved, but manufacturing complexity and risk of processing issues (air sealing, stress) increase
Solution Approach 1:
The package structure is segmented into distinct functional layers including dielectric layers, conductive vias, RDL structures, and dummy items. This segmentation allows each component to be optimized independently while maintaining overall compactness, resolving the contradiction between small package area and manufacturing complexity
Solution Approach 2:
Dummy items are strategically placed in advance during the packaging process to create air paths and prevent air sealing before processing issues can occur. This preliminary action prevents stress and connectivity problems that would otherwise arise in the compact 3D structure
2Reliability
If dummy items are placed to create air paths and prevent air sealing, then reliability is improved, but device complexity increases
Solution Approach 1:
Dummy items serve as intermediary elements that facilitate air path creation and prevent air sealing without directly interfering with the functional components. These dummy items act as mediators between the packaging process requirements and the final package structure, improving reliability while adding minimal complexity
Solution Approach 2:
The dummy items are temporary structures used during the packaging process that can be discarded or removed after serving their purpose of creating air paths and preventing air sealing. This allows reliability improvement without permanent complexity in the final package
Data Source
AI summary
A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.