Integrated Fan-Out Package Bridge Structure for Flexible Die Connections
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently connecting multiple dies in integrated fan-out packages due to the limitations of existing redistribution structures, which require redesigning backend metallization layouts and are costly, with connections often restricted to the shortest distance between dies.
Innovation Solution
The method involves forming an integrated fan-out package by using a carrier with a molding compound to separate dies, a redistribution structure with separate metallization layers, and an external bridge structure to establish electrical connections between dies, allowing for flexible connection patterns and reducing the need for redesigning layouts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If existing redistribution structures are used to connect multiple dies, then electrical connections can be established between dies, but the backend metallization layouts must be redesigned and costs increase
Solution Approach 1:
The patent divides the connection structure into separate components: a redistribution structure with first and second metallization layers, and a distinct bridge structure. This segmentation allows the bridge structure to be designed independently for specific connection needs without redesigning the entire backend metallization layout, thereby reducing manufacturing costs while maintaining reliable electrical connections.
Solution Approach 2:
The bridge structure acts as an intermediary element that connects the first die to the second die through the redistribution structure. This intermediary component enables flexible die-to-die connections without requiring direct redesign of the backend metallization, thus lowering manufacturing costs while ensuring reliable electrical connectivity.
2Reliability
If existing redistribution structures are used to connect multiple dies, then electrical connections can be established, but connections are restricted to the shortest distance between dies
Solution Approach 1:
By separating the connection function into a redistribution structure and an independent bridge structure, the patent enables flexible connection patterns. The bridge structure can be positioned and configured to connect dies at various distances and locations, not limited to the shortest distance, thereby enhancing adaptability while maintaining reliable electrical connections.
Solution Approach 2:
The bridge structure extends the connection capability beyond the planar shortest distance by utilizing vertical and lateral spatial dimensions. This allows connections to be established at non-shortest distances and in various patterns, increasing versatility without compromising electrical connection reliability.
3Adaptability or versatility
If backend metallization layouts are redesigned to enable flexible connections, then connection patterns can be optimized, but manufacturing costs increase
Solution Approach 1:
The patent segments the connection system into a standardized redistribution structure and a configurable bridge structure. This allows connection pattern flexibility to be achieved through bridge structure design rather than redesigning the entire backend metallization, thereby maintaining manufacturing cost efficiency while enabling versatile connection patterns.
Solution Approach 2:
The redistribution structure with its metallization layers is prepared in advance as a standardized component. The bridge structure is then added as a separate preliminary action to achieve specific connection patterns, avoiding the need to redesign the entire backend metallization layout and thus controlling manufacturing costs while providing flexibility.
Data Source
AI summary
An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.