Fan-Out Package Design Eliminates Cavity Process

The patent extracts and eliminates the cavity formation step from the manufacturing process. Instead of forming cavities in the CCL substrate to dispose components, the invention uses a planar substrate surface with conductive patterns directly formed on it. This removal of the cavity process step reduces manufacturing complexity and cost while maintaining component placement precision through alternative means (conductive patterns and alignment features).

The patent segments the manufacturing process into distinct functional layers: a substrate layer, a conductive pattern layer for electrical connection, and an encapsulant layer for protection. By segmenting the functions, the complex cavity formation process is replaced with simpler, more cost-effective processes for each layer, reducing overall manufacturing difficulty and cost while achieving the same functional outcomes.

The patent removes the cavity formation step that causes glass fiber exposure and subsequent defects. By using a planar substrate surface instead of cavities, the source of the defect is eliminated entirely, improving process reliability while maintaining component placement precision through the conductive pattern alignment system.

The patent converts the potential harm of glass fiber exposure into a benefit by using a planar surface design that inherently prevents exposure. The simplicity of the planar structure with integrated conductive patterns actually improves reliability by eliminating the complex cavity walls where glass fibers would be exposed and cause defects.

The patent implements a universal planar substrate design that can accommodate any number of connection terminals without requiring additional cavity formation processes. The conductive patterns on the planar surface can be configured in various arrangements (arrays, grids, or custom patterns) to provide multiple connection terminals, making the same basic structure adaptable to different terminal requirements without increasing process complexity or cost.

The patent transitions from a three-dimensional cavity structure to a two-dimensional planar surface for accommodating multiple connection terminals. By arranging conductive terminals in a planar configuration rather than within vertical cavities, the design can scale to accommodate more terminals by expanding in the horizontal plane rather than requiring additional vertical space or complex multi-level cavity structures, thereby reducing manufacturing complexity.