Fan-Out Package Wall Structure for EMI Shielding and Thermal Dissipation
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Solution Overview
Problem
Integrated fan-out packages face challenges in preventing electromagnetic interference (EMI) that can disrupt the operation of dies, necessitating effective shielding mechanisms within the system.
Innovation Solution
A wall structure with an inner and outer surface is formed around the dies using a three-dimensional printing process, incorporating a framed and staggered portion with through channels for encapsulant flow, and conductive structures for EMI shielding, which also serves as a thermal dissipation structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a wall structure is formed around the dies to provide EMI shielding, then electromagnetic interference protection is improved, but the package area and complexity increase
Solution Approach 1:
The patent combines multiple functions into a single integrated wall structure: EMI shielding through conductive materials, thermal dissipation through heat conduction paths, and structural support through the encapsulant-containing design. This merging approach provides comprehensive protection without proportionally increasing package complexity.
Solution Approach 2:
The wall structure serves multiple purposes simultaneously: it acts as an EMI shield, a thermal management component, and a mechanical support structure. The conductive material provides both electromagnetic shielding and heat conduction, while the encapsulant-filled structure offers both structural integrity and environmental protection.
2Productivity
If the minimum feature size is reduced to increase integration density, then the number of components per area is improved, but the manufacturing precision requirements worsen
Solution Approach 1:
The patent changes the material parameter by using conductive materials with specific electromagnetic shielding properties and thermal conductivity. This allows the wall structure to provide EMI protection and thermal management at reduced feature sizes without sacrificing functional performance, thereby enabling higher integration density while maintaining manufacturing feasibility.
3Object-affected harmful factors
If conductive structures are added for EMI shielding, then electromagnetic protection is improved, but the thermal management capability worsens due to potential heat accumulation
Solution Approach 1:
The patent employs composite material strategy by combining conductive materials for EMI shielding with thermally conductive materials for heat dissipation. The wall structure integrates materials that simultaneously provide electromagnetic shielding and efficient thermal conduction, ensuring that heat generated by the dies is effectively managed even with the addition of conductive shielding structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields against electromagnetic interference and enhances the reliability of the package by ensuring reliable encapsulation and thermal management, thereby maintaining the integrity of the dies' operation.
Implementation Method 1
A wall structure with an inner and outer surface is formed around the dies using a three-dimensional printing process
Implementation Method 2
conductive structures for EMI shielding
Implementation Method 3
which also serves as a thermal dissipation structure
Data Source
AI summary
A package includes a plurality of dies, a wall structure, an encapsulant, and a redistribution structure. The wall structure surrounds at least one of the dies. The encapsulant includes a first portion, a second portion, and a third portion. The first portion is encircled by the wall structure. The second portion encircles the wall structure. The third portion connects the first portion and the second portion. The redistribution structure is disposed on the encapsulant and is electrically connected to the dies and the wall structure.