Fan-Out Wafer Packaging with Printed Antenna Interconnects

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Solution Overview

Problem

Existing Fan-Out Wafer Level Packaging (FOWLP) technologies face high manufacturing costs and environmental impact due to chemical plating or electroplating methods for forming conductive circuits, and there is a need to integrate antennas efficiently within a compact design.

Innovation Solution

A FOWLP unit is constructed using a substrate, dielectric layers, conductive pillars, and conductive circuits formed by filling metal paste into slots and grinding, with antennas embedded within the structure, allowing for efficient electrical connections and reduced thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chemical plating or electroplating is used to form conductive circuits in RDL, then electrical extension and interconnections are improved, but manufacturing cost increases and environmental harm worsens

Engineering Contradiction:

Improveelectrical extension and interconnectionsVSAvoidenvironmental harm and manufacturing cost

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent changes the manufacturing method parameter from chemical/electro plating to screen printing with metal paste. This parameter change maintains the conductive function while eliminating harmful chemicals and reducing cost, directly resolving the contradiction between reliability and environmental harm.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses metal paste as a disposable printing material that can be applied through screen printing. This replaces expensive and environmentally harmful plating materials, achieving cost reduction and environmental protection while maintaining electrical functionality.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Adaptability or versatility

If antennas are integrated into FOWLP unit, then wireless communication function is added, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvewireless communication functionVSAvoidmanufacturing difficulty

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent merges the antenna structure with the dielectric layers and conductive circuits of the FOWLP unit. The antenna is formed using the same screen printing process and metal paste materials as the conductive circuits, integrating multiple functions into a unified structure that reduces manufacturing steps and complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The metal paste and screen printing process serve multiple functions: forming conductive circuits, creating antenna structures, and providing electrical connections. This multi-functionality reduces the number of manufacturing processes needed, thereby reducing overall device complexity despite adding wireless communication capability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Ease of manufacture

If metal paste filling and grinding method is used to form conductive circuits, then manufacturing cost decreases and environmental benefit improves, but manufacturing precision may be affected

Engineering Contradiction:

Improvemanufacturing cost and environmental benefitVSAvoidconductive circuit formation precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the chemical/electrochemical plating system with a mechanical screen printing system. The screen printing process uses a stencil to precisely control metal paste deposition, while grinding provides mechanical planarization. This mechanical approach achieves both cost reduction and maintained precision by using physical rather than chemical processes.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method reduces production costs, enhances reliability, and achieves a more compact and environmentally friendly packaging solution with integrated antennas, meeting light weight and small size requirements.

Implementation Method 1

The first conductive circuits and the second conductive circuits are produced by filling a metal paste into slots and grinding the metal paste

Methodology Applied

Scientific EffectGrinding: Abrasion

Data Source

PatentUS20260018505A1Fan-out wafer level packaging unit

Publication Date: 2026.01.15 WALTON ADVANCED ENG INC

AI summary

A fan-out wafer level packaging (FOWLP) unit which includes a substrate, a first dielectric layer, at least one antenna, at least one die, a second dielectric layer, at least one conductive pillar, a plurality of first conductive circuits, a third dielectric layer, a plurality of second conductive circuits, and an outer protective layer is provided. The first conductive circuits and the second conductive circuits are produced by filling a metal paste into slots and grinding the metal paste. The die is electrically connected with the antenna. The die is electrically connected to the outside through bonding pads around a chip area on a second surface of the die. Thereby the FOWLP unit is formed and problems of the FOWLP module or technology available now generated during manufacturing of the respective conductive circuits including higher manufacturing cost and less environmental benefit can be solved.