Fan-Out PoP Structure Without Dielectric Layers for Thin Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The semiconductor industry faces challenges in achieving compact and reliable package-on-package (PoP) structures due to the complexity and thickness of conventional packaging processes, which often result in increased costs and reliability issues related to voids and breakage in redistribution structures.
Innovation Solution
The proposed solution involves a process flow for manufacturing a PoP structure that includes forming a first redistribution structure on a carrier with a de-bonding layer, followed by the placement of a die and conductive structures, encapsulation, and the formation of a second redistribution structure directly on the encapsulant without intermediate dielectric layers, allowing for flip-chip bonding and reduced thickness, thereby eliminating unnecessary layers and enhancing planarity and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging processes are used with intermediate dielectric layers, then the redistribution structure is more complete, but the overall thickness increases and reliability decreases due to voids and breakage
Solution Approach 1:
The patent removes intermediate dielectric layers from the redistribution structure, extracting only the essential conductive elements that directly contact the encapsulant. This elimination of unnecessary layers reduces thickness and eliminates sources of voids and breakage, thereby improving reliability while maintaining electrical functionality.
Solution Approach 2:
The patent transitions from a multi-layer vertical stacking approach to a more integrated structure where conductive elements extend directly from the first redistribution structure through the encapsulant to the second redistribution structure. This dimensional reorganization eliminates intermediate layers and reduces overall package thickness while maintaining electrical connectivity.
2Ease of manufacture
If conventional packaging processes with multiple layers are used, then the redistribution structure is more complete, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates intermediate dielectric layers from the conventional multi-layer packaging process. This simplification reduces the number of manufacturing steps, decreases material requirements, and lowers production complexity while maintaining the essential redistribution functionality through direct conductive paths.
Solution Approach 2:
The patent merges the functions of multiple separate layers into a more integrated structure where conductive elements directly connect the first and second redistribution structures through the encapsulant. This consolidation reduces manufacturing steps and simplifies the overall process while maintaining electrical connectivity.
3Reliability
If intermediate dielectric layers are included in the redistribution structure, then the structure is more complete, but voids and breakage occur reducing reliability
Solution Approach 1:
The patent removes intermediate dielectric layers that are sources of voids and breakage. By extracting these problematic layers and retaining only the essential conductive elements that directly contact the encapsulant, the patent eliminates the root causes of reliability issues while simplifying the overall structure.
Data Source
AI summary
An integrated fan-out package includes a first redistribution structure, a die, a plurality of conductive structures, an encapsulant, and a second redistribution structure. The die is bonded to the first redistribution structure through flip-chip bonding. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. Top surfaces of the conductive structures contacting the second redistribution structure are coplanar with a top surface of the encapsulant.