Fan-Out RDL Adhesion Layer for Delamination-Resistant Packaging
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Solution Overview
Problem
Current integrated fan-out packages face challenges in achieving efficient adhesion between semiconductor components and encapsulant materials, leading to potential delamination and reliability issues.
Innovation Solution
The formation of an adhesion promoter layer using a metal chelate compound on the through integrated fan-out vias (TIVs) to enhance the bonding between semiconductor components and encapsulant materials, ensuring robust adhesion and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging structures are used without adhesion promoters, then the manufacturing process is simpler, but adhesion between components and encapsulant is insufficient leading to delamination
Solution Approach 1:
An adhesion promoter layer is introduced as an intermediary between the through integrated fan-out vias (TIVs) and the encapsulant material. This intermediate layer chemically or physically bonds to both surfaces, creating a strong interface that prevents delamination while maintaining overall structural simplicity.
Solution Approach 2:
The packaging structure employs composite material construction by combining different materials with complementary properties: the TIVs (typically metal), the adhesion promoter layer (specialized coating material), and the encapsulant (molding compound). This multi-material approach optimizes both adhesion strength and manufacturing feasibility.
2Reliability
If adhesion promoter layer is added to enhance bonding, then adhesion strength improves, but manufacturing process becomes more complex
Solution Approach 1:
The adhesion promoter layer is applied in advance to the TIVs before the encapsulant molding process. This preliminary action ensures that the bonding surface is prepared and optimized for adhesion before the actual encapsulation occurs, streamlining the overall manufacturing sequence.
Solution Approach 2:
The invention modifies the surface properties of the TIVs by applying the adhesion promoter layer, changing parameters such as surface energy, roughness, or chemical composition. These parameter changes enhance the bonding capability without fundamentally altering the manufacturing process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesion promoter layer improves the adhesion between TIVs and encapsulant materials, reducing delamination and enhancing the reliability and durability of integrated fan-out packages.
Implementation Method 1
The formation of an adhesion promoter layer using a metal chelate compound on the through integrated fan-out vias (TIVs) to enhance the bonding between semiconductor components and encapsulant materials
Data Source
AI summary
A semiconductor device includes a first die, a second die, a first redistribution layer (RDL) structure and a connector. The RDL structure is disposed between the first die and the second die and is electrically connected to the first die and the second die and includes a first polymer layer, a second polymer layer, a first conductive pattern and an adhesion promoter layer. The adhesion promoter layer is between and in direct contact with the second polymer layer and the first conductive pattern. The connector is disposed in the first polymer layer and in direct contact with the second die and the first conductive pattern.