Fan-Out Semiconductor Package EMI Shielding Layer
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Solution Overview
Problem
Semiconductor packages face challenges in effectively shielding semiconductor chips from electromagnetic interference (EMI) as they become increasingly exposed to external electromagnetic radiation, particularly in miniaturized and high-density wireless devices, necessitating a cost-effective EMI shielding solution.
Innovation Solution
A semiconductor package design incorporating a fan-out redistribution structure with an EMI shielding layer formed over the encapsulant, which extends over the vertical side surfaces and second major surface, using materials like nickel-gold-palladium alloy for effective EMI and radiofrequency interference (RFI) shielding, and incorporating a die attach layer for secure die attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional semiconductor packaging is used without EMI shielding, then manufacturing cost is reduced and device complexity is minimized, but the semiconductor chips become vulnerable to electromagnetic radiation and reliability deteriorates
Solution Approach 1:
The EMI shielding layer is integrated directly into the packaging structure, merging the shielding function with the package substrate. This combination approach adds EMI protection capability without requiring separate shielding components, thereby improving chip reliability while minimizing additional device complexity
Solution Approach 2:
The packaging structure serves multiple functions simultaneously: mechanical support, electrical connection, and EMI shielding. By making the package substrate multi-functional, the design achieves reliable EMI protection without proportionally increasing device complexity
2Object-affected harmful factors
If EMI shielding layers are added to semiconductor packages, then protection from electromagnetic radiation is improved, but manufacturing cost increases
Solution Approach 1:
The shielding layer uses nickel-gold-palladium alloy with specific compositional parameters optimized for EMI protection. By carefully controlling material parameters and thickness, the design achieves effective shielding while managing manufacturing costs through parameter optimization rather than using excessively thick or expensive materials
Solution Approach 2:
The patent employs a composite material approach using nickel-gold-palladium alloy, which combines the advantages of multiple metals: nickel provides base strength and corrosion resistance, gold provides conductivity and resistance to oxidation, and palladium enhances overall performance. This composite material achieves superior EMI shielding per unit cost compared to single-metal alternatives
3Adaptability or versatility
If miniaturization and high-density packaging are implemented, then device functionality is improved, but exposure to external electromagnetic radiation increases and shielding effectiveness deteriorates
Solution Approach 1:
The EMI shielding layer is applied locally to the packaging structure where EMI protection is most needed, rather than requiring complete enclosure. This localized approach provides targeted protection to sensitive chips while maintaining the miniaturized form factor and high-density packaging configuration
Solution Approach 2:
The shielding protection is extended into the vertical dimension by coating the side walls of the package substrate, not just the top surface. This three-dimensional shielding approach blocks electromagnetic radiation from multiple directions, protecting miniaturized chips that would otherwise be exposed due to reduced packaging dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable EMI and RFI shielding, protecting semiconductor packages from undesirable electromagnetic radiation, enabling deployment in System-on-Chip technology without performance degradation, and offers a cost-effective manufacturing method.
Implementation Method 1
An electromagnetic interference (EMI) shielding layer is formed to line the first major surface and sides of the encapsulant
Data Source
AI summary
Semiconductor packages having an electromagnetic interference (EMI) shielding layer and methods for forming the same are disclosed. The method includes providing a base carrier defined with an active region and a non-active region. A fan-out redistribution structure is formed over the base carrier. A die having elongated die contacts are provided. The die contacts corresponding to conductive pillars. The die contacts are in electrical communication with the fan-out redistribution structure. An encapsulant having a first major surface and a second major surface opposite to the first major surface is formed. The encapsulant surrounds the die contacts and sidewalls of the die. An electromagnetic interference (EMI) shielding layer is formed to line the first major surface and sides of the encapsulant. An etch process is performed after forming the EMI shielding layer to completely remove the base carrier and singulate the semiconductor package.