Fan-Out Semiconductor Packaging for Thin, Insulated Heat Dissipation

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Solution Overview

Problem

Existing semiconductor modules face challenges in reducing thickness while maintaining high heat dissipation and insulating properties due to the presence of heat dissipation blocks and potential short-circuits between wires and heat sinks.

Innovation Solution

A semiconductor device with a fan-out package structure is designed, featuring a semiconductor element covered by an insulating resin material and an extension wire that extends beyond the element's contour, eliminating the need for a heat dissipation block and ensuring a flat interface between the semiconductor element and the sealing material, thus preventing short-circuits and enhancing insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a heat dissipation block is disposed between the semiconductor device and the heat sink, then heat dissipation is improved, but the module thickness increases and device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidmodule thickness

Core Design Contradiction:

TemperatureVSLength of stationary object

Solution Approach 1:

The patent removes the heat dissipation block from the structure entirely. Instead of adding a thermal conductive material between the semiconductor device and heat sink, the invention uses the sealing material itself to provide both sealing and thermal conduction functions, thereby eliminating the need for a separate heat dissipation block and reducing module thickness

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The sealing material is designed to serve multiple functions simultaneously: it provides electrical insulation, mechanical sealing, and thermal conduction. By making the sealing material have high thermal conductivity, it replaces the need for a separate heat dissipation block while maintaining its primary sealing function

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a heat dissipation block is disposed between the semiconductor device and the heat sink, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent merges the sealing function and heat dissipation function into a single component (the sealing material). Instead of having separate sealing material and heat dissipation block, the invention combines these functions by selecting sealing material with high thermal conductivity

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If the wire is connected to the lead terminal, then electrical connection is achieved, but short-circuit risk increases due to contact between wire and heat sink

Engineering Contradiction:

Improveelectrical connectionVSAvoidshort-circuit risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The extension wire acts as an intermediary that extends the electrical connection beyond the semiconductor element contour. By extending the wire connection area and providing proper insulation through the sealing material, it prevents direct contact between the wire and heat sink while maintaining electrical connectivity

Inventive Principle:

Principle #24Intermediary (Mediator)

4Ease of manufacture

If the sealing material covers only part of the front surface, then manufacturing is simplified, but insulation reliability may be compromised

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidinsulation reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The sealing material is strategically positioned to cover critical areas: part of the front surface and the entire side surface of the semiconductor element. This localized coverage provides sufficient insulation where needed (at the wire extension area and side surfaces) while maintaining manufacturing simplicity

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12482714B2Semiconductor device, semiconductor module, and method for manufacturing semiconductor device

Publication Date: 2025.11.25 DENSO CORP

AI summary

A semiconductor device includes a semiconductor element, a sealing material, and an extension wire. The semiconductor element has, on a front surface, a first electrode pad and at least one second electrode pad, and generates a current in a direction connecting the front surface and a back surface. The sealing material is made of an insulating resin material and covers a part of the front surface and a side surface of the semiconductor element. The extension wire is disposed above the semiconductor element and inside the sealing material or on the sealing material. The extension wire is electrically connected to the second electrode pad, and extends from a position inside of a contour of the semiconductor element to a position outside of the contour of the semiconductor element.