Fan-Out Sensor Package Layout for Exposed Sensing Regions
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more reliable packaging techniques for semiconductor dies, particularly in exposing sensing regions while protecting input/output regions, which is crucial for improving integration density and manufacturing yield.
Innovation Solution
The use of integrated fan-out (InFO) packaging technology, which involves forming a sensor package with openings that expose the sensing regions of the sensor die while keeping the input/output regions protected, thereby allowing for a smaller form factor, increased mechanical reliability, and higher manufacturing yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wire bond packaging is used, then the sensing regions can be exposed, but the package size remains large and mechanical reliability is reduced
Solution Approach 1:
The patent segments the sensor die into distinct functional regions (sensing regions and input/output regions) and applies different packaging treatments to each. The sensing regions are exposed through openings in the encapsulant while the input/output regions are protected, allowing the package to be smaller without compromising mechanical reliability or functionality.
Solution Approach 2:
The patent transitions from traditional wire bond packaging to integrated fan-out packaging, changing the dimensional arrangement of interconnects. Instead of using wire bonds that extend outward from the die, the interconnects are redistributed in the plane of the die and encapsulated underneath, reducing the vertical height and overall package volume while improving mechanical reliability.
2Volume of moving object
If integrated fan-out packaging is used to reduce package size, then the form factor is smaller, but the complexity of exposing sensing regions while protecting input/output regions increases
Solution Approach 1:
The patent applies preliminary action by forming the openings in the encapsulant to expose sensing regions before final encapsulation is completed. The input/output regions are protected by the encapsulant material from the outset, eliminating the need for additional protective structures and simplifying the overall packaging process.
Solution Approach 2:
The encapsulant serves multiple functions simultaneously: it protects the input/output regions, provides mechanical support, enables the fan-out interconnect structure, and allows openings to be formed for sensing region exposure. This multi-functionality reduces the need for separate protective components and simplifies the packaging structure.
3Measurement precision
If sensor die is packaged with exposed sensing regions, then sensing accuracy improves, but contamination risk increases
Solution Approach 1:
The patent applies local quality by creating localized openings in the encapsulant only where sensing regions need to be exposed. The encapsulant covers and protects all other regions including input/output regions and interconnect structures, while allowing the sensing regions to remain accessible for their intended function, thus balancing sensing accuracy with contamination protection.
Data Source
AI summary
In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.