Fan-Out Sensor Packaging to Minimize Package Flare
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Solution Overview
Problem
Conventional sensor packages experience package flare when the package or die size is reduced, leading to inefficiencies and potential interference with signal transmission.
Innovation Solution
A sensor package with a fan-out structure that includes a substrate and a sensor module coupled via a material, featuring a fan-out structure connecting the integrated circuit to conductive components, which reduces package size and minimizes flare by positioning the radiation transmitting substrate away from the active region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package or die size is reduced, then the compactness of the sensor package is improved, but package flare is introduced that interferes with signal transmission
Solution Approach 1:
The patent implements a fan-out structure that redistributes conductive components from a concentrated arrangement to a spread-out pattern across multiple dimensions. This dimensional redistribution allows the package to maintain compact overall size while positioning conductive elements away from the active region, thereby reducing package flare and its interference with signal transmission.
Solution Approach 2:
The patent segments the conductive components and interconnect structures into distributed elements across the package substrate. By dividing the conductive path into multiple segments that fan out from the integrated circuit, the structure reduces the concentration of conductive materials near the active region, minimizing package flare while maintaining electrical connectivity.
2Volume of moving object
If the package size is reduced, then the compactness is improved, but signal transmission efficiency deteriorates due to package flare
Solution Approach 1:
The fan-out structure distributes conductive components across extended areas in the horizontal plane, moving them away from the vertical projection of the active region. This spatial redistribution in two dimensions reduces package flare and its negative impact on signal transmission, allowing compact packaging without sacrificing transmission efficiency.
Solution Approach 2:
The patent introduces a substrate as an intermediary platform that supports the fan-out structure. This substrate mediates between the integrated circuit and the external environment, providing a distributed arrangement of conductive components that minimizes package flare while maintaining reliable signal transmission paths.
3Volume of moving object
If conventional package structures are used with reduced size, then compactness is improved, but manufacturing complexity increases due to flare control requirements
Solution Approach 1:
The fan-out structure provides a systematic approach to arranging conductive components in a distributed pattern across the substrate. This dimensional redistribution creates a scalable design that achieves compact packaging while controlling package flare through geometric arrangement, reducing the need for complex additional structures or processes.
Solution Approach 2:
The fan-out structure serves multiple functions simultaneously: it provides electrical interconnects, distributes conductive components to reduce package flare, and maintains compact package dimensions. This multi-functionality reduces the need for separate specialized structures, simplifying the overall package design and manufacturing process.
Data Source
AI summary
A sensor package may include a radiation transmitting substrate. A sensor package may include a sensor module coupled to the radiation transmitting substrate via a material that positions the radiation transmitting substrate away from an active region of the radiation transmitting substrate. The sensor module includes an integrated circuit embedded into the sensor module. The sensor module includes a fan-out structure including a first end portion and a second end portion. The first end portion is coupled to the integrated circuit. The second end portion is coupled to a conductive component. A sensor package may include a substrate coupled to the sensor module.