Face-Up Fan-Out Package Support Structure Alignment
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Solution Overview
Problem
Face-up fan-out electronic packaging faces challenges in electrically coupling passive components to a redistribution layer due to misalignment of conductive pillars and component leads, leading to defects in electrical coupling and increased pitch, which hinders the integration of passive components and affects package size and performance.
Innovation Solution
Incorporating a support structure that positions passive component leads coplanar with a flat mounting surface, allowing for reduced pitch and improved alignment, and using a through-mold via for electrical connection, thereby facilitating the integration of passive components and reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive components are placed face-up without support structure, then manufacturing process is simpler, but alignment between component leads and conductive pillars deteriorates
Solution Approach 1:
A support structure is introduced as an intermediary element between the passive component and the carrier. This support structure includes positioning features that precisely locate the passive component, ensuring proper alignment between the component leads and conductive pillars during the molding process, thereby resolving the alignment precision issue while maintaining manufacturing simplicity
2Reliability
If pitch between conductive pillars and component leads is increased, then locational tolerances are accommodated, but package size increases
Solution Approach 1:
The invention replaces the traditional mechanical alignment approach (relying on adhesive bonding and increased pitch for tolerance) with a precision positioning system. The support structure incorporates positioning features such as recesses, protrusions, or alignment marks that mechanically constrain the passive component location, enabling tight pitch while accommodating tolerances through precise mechanical positioning rather than increased spacing
3Reliability
If cutting or grinding operation is performed to expose conductive pillars, then interconnection is improved, but misalignment with component leads causes defects
Solution Approach 1:
The support structure is designed with positioning features that pre-align the passive component and conductive pillars before the molding process. This preliminary positioning ensures that when the mold is cut or ground to expose the conductive pillars, they are already correctly positioned relative to the component leads, eliminating misalignment defects and ensuring reliable electrical interconnection
Data Source
AI summary
A face-up fan-out electronic package including at least one passive component located on a support. The electronic package can include a die. The die can include a plurality of conductive pillars having a proximal end communicatively coupled to the first side of the die and a distal end opposite the proximal end. A mold can at least partially surround the die. The mold can include a first surface that is coplanar with the distal end of the conductive pillars and a second surface opposing the first surface. In an example, the passive component can include a body and a lead. The passive component can be located within the mold. The lead can be coplanar with the first surface, and the body can be located at a distance from the second surface. The support can be located between the body and the second surface.