Fan-Shaped Probe Array for Semiconductor TEG Evaluation
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Solution Overview
Problem
As semiconductor devices miniaturize, the scribe area on wafers decreases, requiring smaller Test Element Groups (TEGs) with efficiently arranged electrode pads for probe contact, which existing techniques fail to efficiently manage due to independent probe control and layout challenges.
Innovation Solution
The use of a plurality of probes arranged in a fan shape or manufactured using Micro Electro Mechanical Systems (MEMS) technology to facilitate efficient contact with electrode pads, improving the layout and productivity in semiconductor device manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If each probe is independently mounted and controlled, then the probes can contact the electrode pads, but it takes time to control each probe and the process becomes complex
Solution Approach 1:
The probe unit is divided into multiple independent probes arranged in a fan shape, where each probe can be controlled independently or collectively. This segmentation allows for efficient contact with multiple electrode pads simultaneously while maintaining individual control capability when needed.
Solution Approach 2:
Multiple probes are integrated into a single probe unit that moves together as one component. This merging reduces the complexity of controlling individual probes separately, as the entire fan-shaped array can be positioned and controlled as a unified structure, significantly reducing the time and control complexity.
2Area of stationary object
If the scribe area on the wafer decreases due to miniaturization, then smaller TEGs are required, but it becomes more difficult to efficiently arrange electrode pads for probe contact
Solution Approach 1:
The probes are arranged in a fan shape rather than a linear or grid pattern, utilizing angular distribution to maximize contact efficiency within the limited scribe area. This dimensional arrangement allows multiple electrode pads to be accessed simultaneously without requiring additional linear space.
Solution Approach 2:
The fan-shaped probe arrangement allows for optimized local contact points at different angular positions, enabling efficient contact with electrode pads that are densely packed in the reduced scribe area. Each probe can be precisely positioned to contact its corresponding electrode pad.
Data Source
AI summary
As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Therefore, it is necessary to associate probes and the efficient layout of the electrode pad. The purpose of the present invention is to provide a technique for associating probes and the layout of the electrode pads of a TEG so as to facilitate the evaluation of electrical characteristics. According to an evaluation apparatus for a semiconductor device of the present invention, the above described problems can be solved by providing a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology.