Fan-Shaped Susceptor Heaters for Thermal Uniformity

Solution Overview

Problem

Conventional susceptor heaters in semiconductor and LCD manufacturing tools fail to achieve a substantially uniform temperature profile on substrates, especially in multi-station reaction chambers due to thermal interactions with surrounding environments.

Innovation Solution

The implementation of a semiconductor processing apparatus with independently controlled fan-shaped heating or cooling elements in multiple zones per susceptor, allowing for precise control of temperature across different zones to compensate for thermal interactions, and a controller to manage heat distribution across these zones to achieve uniform temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional susceptor heaters are used in multi-station reaction chambers, then the heating function is provided, but the temperature profile on the substrate surface becomes non-uniform due to thermal interactions with surrounding environment

Engineering Contradiction:

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The susceptor heater is divided into multiple independently controlled heating zones (first heating zone, second heating zone, third heating zone, fourth heating zone) with separate heating elements. Each zone can be controlled independently to compensate for thermal interactions from surrounding environment, allowing non-uniform thermal环境影响 to be counteracted by adjusting individual zone temperatures to achieve overall uniform substrate heating

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different heating zones are assigned different heating characteristics and control parameters based on their local thermal environment. Zones experiencing greater thermal loss to surrounding environment receive higher heating power, while zones with less thermal loss receive lower power, creating locally optimized heating that results in globally uniform temperature distribution

Inventive Principle:

Principle #3Local quality

2Temperature

If multiple independently controlled heating zones are implemented per susceptor, then temperature uniformity is improved, but device complexity increases

Engineering Contradiction:

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The heating system is segmented into multiple zones with independent control, allowing precise temperature management in each region to achieve uniform overall heating despite thermal interactions from surrounding environment

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each heating zone operates with independently adjustable temperature parameters and power levels, enabling dynamic adaptation to local thermal conditions and compensation for environmental thermal interactions through parameter optimization

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a substantially uniform temperature profile on substrates, enhancing temperature uniformity and consistency across multi-station process chambers, which is critical for semiconductor processing.

Implementation Method 1

a first independently controlled fan-shaped heating or cooling element, the first heating or cooling element configured to provide independent heating or cooling to a first heating zone of a surface of the first susceptor

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the first heating or cooling element comprises a cooling element, and wherein heating or cooling the first heating zone comprises flowing a coolant through the cooling element

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

the first heating or cooling element comprises a heating element, wherein the heating element comprises a resistive heater, and wherein heating or cooling the first heating zone comprises providing power to the resistive heater

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20230137187A1Methods and apparatuses for prevention of temperature interaction in semiconductor processing systems

Publication Date: 2023.05.04

AI summary

Described herein are reactor chamber configurations in which susceptors are provided with one or more that or heaters equipped with fan-shaped separational temperature control functions. In some embodiments, the heaters, in conjunction with an active cooling mechanism may be configured to compensate for temperature non-uniformity caused by, for example, adjacent structures including heat sources and heat sinks. In some embodiments, separate temperature control may be achieved by multi-zone independent heating or cooling elements within each susceptor.