Fan Assembly Support Structure for VR Device Thermal Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Portable electronic devices, particularly those used in virtual and augmented reality systems, face challenges in effectively dissipating heat and managing mechanical stresses, leading to potential failure and reduced performance.
Innovation Solution
The implementation of a thermal management system that includes a temperature sensor for detecting over-temperature conditions, a power supply for electrical communication, and a fan assembly with a shaft support structure that controls transverse loading to minimize noise and vibrations, while also optimizing airflow for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan assembly is added to dissipate heat, then thermal dissipation is improved, but mechanical loading and vibrations increase
Solution Approach 1:
A shaft support structure is introduced as an intermediary component between the fan assembly and the device housing. This support structure absorbs and distributes the mechanical loads and vibrations generated by the fan, preventing them from being directly transmitted to the housing and other components, thus resolving the contradiction between effective cooling and mechanical stress reduction
2Temperature
If thermal management components are added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The shaft support structure is designed to combine multiple functions: it provides mechanical support for the fan assembly, absorbs vibrations, and integrates with the device housing structure. By merging these functions into a single integrated component rather than adding separate elements, the solution improves thermal management while minimizing the increase in device complexity
3Temperature
If fan speed is increased to improve cooling, then heat dissipation is improved, but noise and vibrations increase
Solution Approach 1:
The shaft support structure acts as a vibration isolation intermediary that allows the fan to operate at higher speeds for improved cooling efficiency while the support structure absorbs and dampens the resulting vibrations and noise, preventing them from propagating to the device housing and user interface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages thermal and mechanical stresses, ensuring the reliable operation of portable electronic devices by maintaining optimal temperatures and reducing mechanical wear, thereby enhancing their performance and longevity.
Implementation Method 1
a temperature sensor configured to detect an over-temperature condition of the electronic device
Implementation Method 2
a fan configured to cool the processing electronics and/or the energy storage device
Implementation Method 3
The thermal mitigation assembly removes heat generated from one or both of the battery and the electronic components
Data Source
AI summary
Various embodiments relate to a thermal management system for an electronic device, such as an augmented reality or virtual reality device. The thermal management system can comprise an active cooling mechanism in various embodiments to dynamically or actively cool components of the device, for example, by adjust fan speeds of a fan assembly. In some embodiments, a hardware shutdown mechanism can be provided to shut down the device if software-based thermal management devices are inoperable. In some embodiments, the air flow into and/or within the electronic device can be adjusted to cool various components of the device.