Fanless Computer Case Heat Transfer Plate Design
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Solution Overview
Problem
High-performance small form factor computers face challenges in managing heat effectively, especially when quiet operation is desired, as traditional cooling methods like fans are not feasible.
Innovation Solution
A fanless computer case assembly that utilizes thermal accessories and strategically positioned heat transfer plates made from high thermal conductivity materials like copper and aluminum to distribute heat away from critical components and into the environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling methods like fans are used, then heat management is improved, but noise increases and device complexity increases
Solution Approach 1:
The patent removes the fan (disturbing part) from the cooling system and replaces it with passive heat transfer components. The harmful factor (noise from fan operation) is eliminated while heat management is maintained through alternative means.
Solution Approach 2:
The patent replaces the mechanical fan-based cooling system with a thermal conduction-based passive cooling system. Heat transfer plates and thermally conductive materials substitute for the mechanical action of fans, enabling quiet operation.
2Temperature
If traditional cooling methods like fans are used, then heat management is improved, but device complexity increases
Solution Approach 1:
The patent extracts and removes the fan and associated cooling system components, simplifying the overall device structure. The remaining passive heat transfer components (heat transfer plates, thermally conductive materials) provide cooling functionality with minimal complexity.
Solution Approach 2:
The patent replaces the complex mechanical fan-based cooling system with simpler thermal conduction components. The substitution of mechanical systems with passive thermal materials reduces device complexity while maintaining heat management effectiveness.
3Temperature
If heat transfer plates are added to manage heat, then heat management is improved, but device complexity increases
Solution Approach 1:
The heat transfer plates serve multiple functions: they conduct heat away from hot components, distribute heat evenly across surfaces, and provide structural support. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity.
Solution Approach 2:
The patent combines heat transfer functionality with existing structural components. The heat transfer plates are integrated with the case structure and component mounting plates, merging thermal management functions into the overall device architecture rather than adding separate complex systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively manages heat without the need for fans, ensuring quiet operation while maintaining performance by efficiently transferring heat from the CPU, RAM, and SSD through the use of thermal accessories, thereby addressing the challenge of heat management in compact, quiet systems.
Implementation Method 1
Heat from the central processing unit transfers through the lower CPU mounting plate, is spread across the first heat transfer plate through the bottom cover, and through the thermal accessory
Implementation Method 2
Heat from the central processing unit transfers through the lower CPU mounting plate, is spread across the first heat transfer plate through the bottom cover, and through the thermal accessory
Data Source
AI summary
A fanless computer case assembly is configured to distribute heat from a computer through a thermal accessory. The fanless computer case assembly includes a fanless computer case that has a bottom cover joined to a front panel and a rear panel. A top cover is joined to the front panel and the rear panel. A mother board includes a central processing unit is arranged between the front panel and the rear panel. An upper CPU mounting plate and a lower CPU mounting plate are joined to the central processing unit. A base plate is attached to the upper CPU mounting plate and the top cover with a spacer creating an air gap between the base plate and the top cover. A first heat transfer plate is attached to the lower CPU mounting plate and the bottom cover.