Fanless Heat Dissipation via Segmented Connecting Element
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Solution Overview
Problem
Existing fanless heat dissipating systems require larger spaces due to the need for straight heat pipes, which limits size reduction and increase costs, and often suffer from electromagnetic interference (EMI) issues due to inadequate grounding.
Innovation Solution
An electronic system with a circuit board, through holes, grounding units, and connecting elements that eliminate the need for curved heat pipes, allowing for reduced size and cost, while using resilient members to enhance grounding and suppress EMI signals through increased electromagnetic compatibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a straight heat pipe is used in a fanless heat dissipating system, then the heat dissipation function is achieved, but the space required increases and the product size must be enlarged
Solution Approach 1:
The heat dissipation system is divided into separate functional modules: a heat generating component, a heat dissipation component with its own heat pipe, and a connecting element. This segmentation allows each component to be optimized independently and connected through a compact interface, eliminating the need for a large curved heat pipe while maintaining effective heat transfer pathways.
Solution Approach 2:
A connecting element is introduced as an intermediary component between the heat generating component and the heat dissipation component. This connector enables thermal coupling while allowing compact spatial arrangement, replacing the need for a curved heat pipe that would otherwise be required to bridge distant components.
2Volume of moving object
If the heat pipe is curved to reduce space, then the product size is reduced, but the heat dissipating effect deteriorates
Solution Approach 1:
By separating the heat generating component and heat dissipation component into distinct modules connected by a connecting element, the system avoids the need to curve the heat pipe. The straight heat pipe in the heat dissipation component maintains optimal heat transfer while the connecting element handles the spatial transition.
Solution Approach 2:
The connecting element acts as a mediator that bridges the spatial gap between components without requiring the heat pipe itself to be curved. This intermediary approach preserves the heat pipe's straight configuration and optimal thermal performance while achieving compact overall design.
3Object-generated harmful factors
If noise is coupled to the heat sink and improper grounding is used, then EMI signals are emitted, but electromagnetic compatibility is poor
Solution Approach 1:
The heat dissipation component, which could potentially act as an EMI antenna, is converted into a grounded shield. By providing multiple grounding paths through grounding units on the circuit board and connection to the heat dissipation component, the system transforms a potential EMI source into an EMI suppression element that protects other components.
Solution Approach 2:
The heat dissipation component serves dual functions: it dissipates heat from the heat generating component and simultaneously acts as a grounding element for EMI suppression. This multi-functionality eliminates the need for separate EMI shielding components and improves electromagnetic compatibility while maintaining compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation, reduces product size and cost, and enhances electromagnetic compatibility, leading to improved performance, operation quality, and extended lifespan of electronic devices.
Implementation Method 1
the heat pipe 12 performs a cooling process according to the property of absorbing or dissipating heat during the phase-change procedure
Implementation Method 2
the liquid evaporates into vapor flowing to the other end under a minor pressure difference
Implementation Method 3
the vapor releases heat and condenses into the liquid
Implementation Method 4
the liquid flows back to the evaporating section according to the capillary property
Implementation Method 5
The connecting element is disposed through the through hole of the circuit board and connects the first conducting element with the second conducting element
Data Source
AI summary
An electronic system includes a circuit board, a first conducting element, a second conducting element and at least one connecting element. In this case, the circuit board has at least one through hole and at least one grounding unit disposed around the through hole. The first conducting element is disposed on one side of the circuit board, and the second conducting element is disposed on the other side of the circuit board. The connecting element is disposed through the through hole for connecting the first conducting element and the second conducting element.