Fanless Cooling System for Rail Vehicle Processor Modules
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Solution Overview
Problem
High-performance multi-core processors in rail vehicles generate excessive heat that cannot be dissipated efficiently using simple cooling bodies with free air convection, limiting the use of such processors in critical applications like train protection equipment due to safety and reliability concerns.
Innovation Solution
A fanless cooling system utilizing conduction cooling with heat pipes and a frame-shaped rack as a heat sink, where heat is conducted from the processor module to the rack and dissipated through convection, allowing for efficient heat transfer without the need for fans or complex cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If simple cooling bodies with free air convection are used, then the device complexity is reduced, but the heat dissipation capability is insufficient for high-performance multi-core processors
Solution Approach 1:
The cooling system is segmented into multiple functional components: heat transport bodies attached to individual processor modules, heat distribution bodies mounted on the rack structure, and heat pipes connecting them. This segmentation allows each component to perform its specific thermal management function efficiently while maintaining overall system simplicity.
Solution Approach 2:
The rack structure is merged with the heat distribution function by integrating heat distribution bodies directly onto the rack. The rack simultaneously provides mechanical support for modules and serves as a thermal conduction path to dissipate heat, eliminating the need for separate cooling infrastructure.
2Temperature
If active cooling systems with fans or water cooling are implemented, then the heat dissipation capability is improved, but the reliability is reduced due to additional failure points
Solution Approach 1:
The cooling system operates passively using natural convection and conduction principles. Heat automatically flows from hot regions (processors) to cold regions (rack environment) through the heat transport bodies and heat pipes without requiring external power or active control mechanisms, eliminating fan failures and water leakage risks.
Solution Approach 2:
The patent replaces mechanical active cooling systems (fans, pumps) with passive thermal conduction and convection mechanisms. Heat is transferred through solid conduction paths (heat pipes, heat distribution bodies) and dissipated through natural air convection, eliminating moving parts and fluid dynamics complexity.
3Productivity
If high-performance multi-core processors are used, then the productivity is improved, but the heat generation increases beyond what simple cooling can handle
Solution Approach 1:
Heat transport bodies and heat pipes serve as thermal intermediaries between the high-power processors and the rack environment. These intermediary components efficiently conduct heat away from the processor cores and distribute it across larger surface areas for dissipation, enabling high-performance processors to operate within safe temperature ranges.
4Ease of operation
If modular design is maintained for easy module swapping, then the ease of operation is improved, but the thermal connection reliability may be compromised
Solution Approach 1:
Heat transport bodies are pre-attached to processor modules during manufacturing, establishing reliable thermal connections before deployment. This preliminary thermal interface preparation ensures that when modules are swapped, the thermal connection is already optimized and does not require field adjustment or rework.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a fault-tolerant and efficient cooling method for high-power processor modules, maintaining operational safety and reliability by effectively dissipating heat without limiting module swapping or increasing complexity, suitable for high-reliability applications like train protection equipment.
Implementation Method 1
a heat transport body (18), which can be attached to a part of the module (3) in a heat-transferring manner
Implementation Method 2
at least one heat pipe (35) connected to the heat distribution body (26) in a heat-transferring manner
Implementation Method 3
dissipated through convection
Data Source
AI summary
A fanless cooling system for particularly fail-safe and efficient cooling of electronic modular systems in vehicles, more particularly in rail vehicles, includes a preferably frame-shaped rack or assembly carrier for holding at least one module or assembly, more particularly a processor module having high-performance multi-core processors. A heat transport body can be mounted in a heat-transferring manner on a part or component of the module. The rack has at least one heat distribution body, to which the heat transport body can be fastened in a heat-transferring manner, preferably detachably, when the module having the part coupled to the heat transfer body is held in the rack. At least one heat tube is connected to the heat distribution body in a heat-transferring manner. An electronic modular system with a fanless cooling system is also provided.