Fan-out antenna packaging structure for RF chip integration

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Solution Overview

Problem

Existing radio frequency chip packaging requires external antenna connections, leading to increased PCB area and inefficiencies in antenna layout, which compromises both space and performance.

Innovation Solution

A fan-out antenna packaging structure and method that integrates a single-layer antenna structure and redistribution layer on the chip packaging, using photo-etching to form both layers simultaneously, reducing manufacturing costs and antenna size while enhancing gain.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external antenna connections are used for radio frequency chips, then antenna functionality is achieved, but PCB area increases and layout efficiency decreases

Engineering Contradiction:

Improveantenna functionalityVSAvoidPCB area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the antenna structure with the chip packaging structure by integrating the antenna into the plastic packaging layer. The antenna pattern is formed within the packaging material itself, combining two previously separate functions (chip packaging and antenna radiation) into a single integrated structure, thereby eliminating the need for separate external antenna connections and reducing PCB area occupation.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions the antenna from a two-dimensional PCB layout to a three-dimensional structure embedded within the packaging layer. By forming the antenna pattern within the volumetric packaging material rather than on the planar PCB surface, the solution utilizes the third dimension (depth/thickness of packaging) to achieve antenna functionality without increasing PCB footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If antennas are directly laid out on PCB to ensure antenna gain, then antenna performance is improved, but PCB area is sacrificed

Engineering Contradiction:

Improveantenna gainVSAvoidPCB area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The antenna structure is merged with the packaging layer, allowing the antenna pattern to be formed within the packaging material. This integration maintains the antenna's radiation performance and gain characteristics while eliminating the need for dedicated PCB real estate, as the antenna now resides in the packaging dimension rather than consuming PCB surface area.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent changes the physical medium in which the antenna operates from PCB substrate to packaging material (e.g., epoxy resin). This parameter change in the surrounding material affects the antenna's electromagnetic characteristics, allowing optimization of antenna gain and performance within the new medium while maintaining compact dimensions.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional fan-out wafer level packaging method is used, then chip packaging is achieved, but antenna integration is not possible

Engineering Contradiction:

Improvechip packagingVSAvoidantenna integration

Core Design Contradiction:

Ease of manufactureVSAdaptability or versatility

Solution Approach 1:

The patent modifies the conventional fan-out wafer level packaging process to serve multiple functions: chip support, electrical connection, and antenna formation. The plastic packaging layer is transformed from a purely protective encapsulation into a multi-functional element that simultaneously provides mechanical support, electrical isolation, and electromagnetic radiation capability, thereby enabling antenna integration within the packaging process.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The antenna pattern is formed within the packaging layer during the packaging process itself, before final chip assembly and testing. By pre-forming the antenna structure in the packaging material prior to chip mounting and wire bonding, the solution enables seamless integration without requiring additional post-packaging antenna fabrication steps.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces antenna size, improves gain, and integrates the antenna structure within the chip packaging, addressing the inefficiencies of prior art by minimizing PCB area usage and enhancing overall packaging integration.

Implementation Method 1

using photo-etching to form both layers simultaneously

Methodology Applied

Scientific EffectPhoto-etching:

Data Source

PatentUS10714435B2Fan-out antenna packaging structure and method making the same

Publication Date: 2020.07.14 SJ SEMICONDUCTOR (JIANGYIN) CORP

AI summary

The present application provides a fan-out antenna packaging structure and a method making the same. The method comprises: providing a carrier and forming a release layer on an upper surface of the carrier; forming a chip structure on an upper surface of the release layer, the chip structure comprises an unpacked chip and a contact pad disposed on and electrically connected to the unpacked chip; forming a plastic packaging layer packaging the chip structure on the upper surface of the release layer; removing the carrier and the release layer to expose the contact pad; forming a single-layer antenna structure and forming a redistribution layer on the surface where the contact pad is disposed; forming an under-bump metal layer on an upper surface of the redistribution layer; and forming a solder ball bump on an upper surface of the under-bump metal layer.