Fan-out antenna packaging structure for compact PCB integration
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Solution Overview
Problem
Existing fan-out wafer level packaging methods require large antennas to ensure antenna gain, leading to increased PCB size and area, which is inefficient in terms of space and integration.
Innovation Solution
A fan-out antenna packaging structure with a semiconductor chip, a plastic packaging material layer, a metal connecting pole, an antenna structure on the packaging material layer, and a redistribution layer, where the antenna structure is electrically connected to the metal connecting pole and the semiconductor chip, allowing for compact design and improved antenna gain.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If large antennas are used to ensure antenna gain, then communication performance is improved, but PCB area increases
Solution Approach 1:
The patent merges the antenna structure with the packaging material layer, integrating the antenna into the packaging substrate itself. This combination allows the antenna to be formed within the packaging structure rather than requiring separate PCB space, thereby maintaining antenna gain while reducing overall PCB area
Solution Approach 2:
The patent transitions the antenna design from a two-dimensional PCB surface layout to a three-dimensional structure embedded within the packaging material layer. By utilizing the vertical dimension and embedding the antenna pattern within the layered packaging structure, the design achieves adequate antenna gain without proportionally increasing PCB footprint
2Productivity
If fan-out wafer level packaging is used to increase integration density, then I/O ports and wiring density are improved, but manufacturing process complexity increases
Solution Approach 1:
The patent performs preliminary actions by pre-forming the antenna pattern within the packaging material layer during the packaging process itself, rather than requiring subsequent separate antenna fabrication steps. The metal connecting poles are also pre-positioned within the packaging structure, enabling integrated antenna formation before final assembly and reducing overall manufacturing complexity
Data Source
AI summary
The present disclosure provides a fan-out antenna packaging structure and a method for preparing the same. The fan-out antenna packaging structure comprises: a semiconductor chip; a plastic packaging material layer comprising a first surface and an opposite second surface, wherein the plastic packaging material layer packages a periphery of the semiconductor chip; a metal connecting pole located in the plastic packaging material layer and running through the plastic packaging material layer from top to bottom; an antenna structure located on the first surface of the plastic packaging material layer and electrically connected with the metal connecting pole; are distribution layer located on the second surface of the plastic packaging material layer and electrically connected with the semiconductor chip and the metal connecting pole; and a solder bump located on a surface, insulated from the plastic packaging material layer, of the redistribution layer, and electrically connected with the redistribution layer.