Fan-Out BGA Package Structure with Integrated Redistribution Layer
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Solution Overview
Problem
Semiconductor device packaging with multi-carrier structures faces challenges in size and manufacturing cost due to increased complexity and thickness, particularly in BGA packaging technologies where a redistribution layer connects input/output pads to external pads, and the use of multiple carriers for mounting on system boards.
Innovation Solution
A surface mount structure comprising a redistribution structure, electrical connections, and an encapsulant, where the redistribution structure has a first and second surface, with the electrical connections exposed by the encapsulant, allowing for flexible package design and reduced manufacturing complexity by adjusting the encapsulant width, and using a combination of metal and elastic components for the electrical connections to enhance flexibility and control exposure height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a multi-carrier structure is used for BGA packaging, then the package can support higher lead counts and provide redistribution layers for mounting on system boards, but the package thickness increases and manufacturing complexity increases
Solution Approach 1:
The patent combines multiple carriers into a single integrated carrier structure that supports both the semiconductor device and the redistribution layer. This merged structure eliminates the need for separate multi-carrier assemblies while maintaining the functionality of mounting on system boards and providing higher lead counts through the integrated design.
2Adaptability or versatility
If a multi-carrier structure is used for BGA packaging, then the package can support higher lead counts and provide redistribution layers for mounting on system boards, but the package thickness increases
Solution Approach 1:
The patent transitions from a vertical stacking approach (multiple carriers stacked vertically increasing thickness) to a planar integration approach where the redistribution layer is formed on the same carrier plane as the semiconductor device. This dimensional reorganization maintains mounting capability while significantly reducing package thickness.
3Reliability
If traditional BGA packaging with multiple carriers is used, then electrical connections can be established, but manufacturing cost increases due to increased complexity
Solution Approach 1:
The patent merges the semiconductor device carrier and the redistribution layer carrier into a single integrated structure, reducing the total number of components and assembly steps. This integration maintains reliable electrical connections while lowering manufacturing costs by eliminating the need for multiple carrier handling, alignment, and bonding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a thinner, more cost-effective semiconductor device package with design flexibility, improved electrical connection exposure control, and reduced manufacturing costs by simplifying the package structure and using elastic components to recover from molding shapes, thus facilitating easier surface mounting on circuit boards.
Implementation Method 1
The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.
Implementation Method 2
using elastic components to recover from molding shapes, thus facilitating easier surface mounting on circuit boards
Data Source
AI summary
A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.