Fan-Out Package Structure for Shorter IPD Routing Distance
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Solution Overview
Problem
The semiconductor industry faces challenges in integrating high-functional electronic components into small packages while maintaining high performance and low cost, particularly due to the need for miniaturization and efficient electrical routing, where existing packaging technologies struggle to reduce the distance between semiconductor devices and integrated passive devices effectively.
Innovation Solution
A device package structure is formed by creating a redistribution structure over a carrier substrate, attaching an integrated passive device between this structure and an interconnect structure, and then attaching a semiconductor device, which reduces the distance between the semiconductor device and the integrated passive device, thereby improving electrical performance by minimizing routing distance and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional packaging technologies are used, then package size can be reduced, but the distance between semiconductor devices and integrated passive devices cannot be reduced effectively
Solution Approach 1:
The patent implements fan-out wiring that extends electrical connections in lateral dimensions beyond the vertical stacking of components. The redistribution layer routes signals outward from the compact vertical arrangement, effectively using planar dimensionality to reduce electrical path length without increasing package footprint or manufacturing complexity
Solution Approach 2:
The patent introduces a redistribution layer as an intermediary structure between the semiconductor device and integrated passive devices. This intermediate layer provides additional routing paths that shorten the electrical distance between components while maintaining a compact physical layout, resolving the contradiction between component proximity and manufacturing ease
2Adaptability or versatility
If more input/output pads are integrated, then functionality increases, but package size increases
Solution Approach 1:
The fan-out wiring structure extends electrical connections laterally beyond the vertical footprint of the semiconductor device, allowing multiple I/O pads to be accessed within a compact package area. This dimensional approach enables high functionality without proportionally increasing package size
Solution Approach 2:
The redistribution layer serves multiple functions simultaneously: it provides electrical routing for numerous I/O pads, enables compact packaging, and maintains signal integrity. This multi-functional structure allows high functionality to be achieved without linearly increasing package area
3Reliability
If routing distance is reduced, then electrical performance improves, but manufacturing precision requirements increase
Solution Approach 1:
The redistribution layer is formed as a pre-established routing infrastructure before final component placement. This preliminary routing structure provides defined, controlled pathways that reduce electrical distance while maintaining manufacturability through standardized fabrication processes rather than requiring high-precision custom routing
Data Source
AI summary
A method includes forming a redistribution structure on a carrier, attaching an integrated passive device on a first side of the redistribution structure, attaching an interconnect structure to the first side of the redistribution structure, the integrated passive device interposed between the redistribution structure and the interconnect structure, depositing an underfill material between the interconnect structure and the redistribution structure, and attaching a semiconductor device on a second side of the redistribution structure that is opposite the first side of the redistribution structure.