Fan-Out Package Anchoring Structure for Terminal Reliability

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Solution Overview

Problem

Fan-out semiconductor packages face reliability issues due to insufficient surface roughness of external connection terminals, which can lead to separation under thermal or mechanical stress, affecting their performance in harsh environments.

Innovation Solution

The fan-out semiconductor package incorporates a reinforcing layer with voids that increase the surface roughness of the opening, allowing the external connection terminal to form an anchoring structure, enhancing the connection force and reliability, particularly in tests like TCoB and drop tests.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the external connection terminal has a smooth surface, then the manufacturing process is simple, but the connection reliability is insufficient under thermal or mechanical stress

Engineering Contradiction:

Improveconnection reliabilityVSAvoidsurface structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a porous reinforcing layer containing voids between the encapsulant and external connection terminal. This porous structure increases surface roughness and provides anchoring sites for the external connection terminal, thereby improving connection reliability without significantly complicating the manufacturing process.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The patent adds a new dimensional element by introducing a reinforcing layer with vertical voids between the encapsulant and external connection terminal. This creates a three-dimensional anchoring structure that enhances mechanical interlocking and connection reliability, transforming a two-dimensional surface contact into a three-dimensional interlocked joint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Strength

If voids are introduced in the reinforcing layer, then the anchoring force is enhanced, but the manufacturing precision requirements increase

Engineering Contradiction:

Improveconnection forceVSAvoidvoid formation precision

Core Design Contradiction:

StrengthVSManufacturing precision

Solution Approach 1:

The voids in the reinforcing layer are formed preliminarily before the external connection terminal is attached. This preliminary formation of voids creates pre-prepared anchoring sites that guide the external connection terminal during attachment, reducing the precision requirements during the final assembly process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The reinforcing layer acts as an intermediary between the encapsulant and the external connection terminal. The voids within this intermediary layer provide mechanical interlocking without requiring direct high-precision contact between the encapsulant and the external connection terminal, thereby reducing overall manufacturing precision requirements.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the opening surface roughness is increased, then the interfacial reliability is improved, but the manufacturing complexity increases

Engineering Contradiction:

Improveinterfacial reliabilityVSAvoidmanufacturing ease

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The reinforcing layer is designed as a porous material containing voids that increase the effective surface area and roughness of the opening. This porous structure provides mechanical interlocking for the external connection terminal, improving interfacial reliability while maintaining ease of manufacture through a single integrated layer.

Inventive Principle:

Principle #31Porous materials

Solution Approach 2:

The patent merges the reinforcing layer and the opening structure into a single integrated component. The voids are formed within the reinforcing layer itself rather than requiring separate surface treatment processes, thereby improving interfacial reliability without significantly increasing manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves the reliability of the external connection terminals by preventing separation and ensuring robust interfacial reliability even in harsh conditions, thus enhancing the overall performance of the fan-out semiconductor package.

Implementation Method 1

A wall surface of the opening has a surface roughness greater than a surface roughness of an exposed surface of the pad... allowing the external connection terminal to form an anchoring structure, enhancing the connection force

Methodology Applied

Scientific EffectMechanical interlocking:

Data Source

PatentUS10892227B2Fan-out semiconductor package

Publication Date: 2021.01.12 SAMSUNG ELECTRONICS CO LTD

AI summary

A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.