Fanout Package Back Side Metallization Integration
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Solution Overview
Problem
Microelectronics packaging faces challenges with increasing manufacturing tolerances and component thickness variations, which limit production rates and package size reduction, especially when integrating multiple components with different thicknesses into a single package.
Innovation Solution
The solution involves stacking components back-to-back with a molding compound layer and using electrically conductive columns formed from stacked stud bumps to establish electrical connections, allowing for adjustable thickness compensation and non-destructive fabrication, thereby accommodating various component thicknesses and vendors' variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple components with different thicknesses are integrated into a single package, then component integration is achieved, but manufacturing tolerances increase and rejection rates increase
Solution Approach 1:
The patent divides the package into multiple independent component layers (first component layer, second component layer, third component layer) that can be manufactured separately with different thicknesses and then stacked together. This segmentation allows each component to be optimized independently while maintaining overall package integration, resolving the contradiction between component diversity and manufacturing precision.
Solution Approach 2:
The patent implements a stacked configuration where components are arranged in nested layers (first component, second component, third component stacked in sequence). This nesting approach allows components of varying thicknesses to be integrated without interfering with each other's manufacturing tolerances, as each layer is independent yet part of the unified package structure.
2Length of stationary object
If components are stacked back-to-back to reduce package size, then package thickness is reduced, but electrical interconnection complexity increases
Solution Approach 1:
The patent introduces an intermediary conductive layer (fourth component layer with conductive traces) that facilitates electrical connections between the stacked components. This intermediary layer simplifies the interconnection process by providing a standardized interface between components, reducing the overall complexity of electrical interconnections while maintaining the compact back-to-back stacking configuration.
Solution Approach 2:
The patent transitions from planar electrical interconnections to three-dimensional vertical interconnections through the stacked configuration. By moving electrical connections into the vertical dimension (through conductive traces and vias in the stacked layers), the package achieves size reduction in the horizontal plane while managing interconnection complexity through the additional vertical dimension.
3Adaptability or versatility
If different sized components are used within a single package, then design flexibility is improved, but further package size reduction is limited
Solution Approach 1:
The patent resolves the conflict between design flexibility and package size reduction by transitioning to a three-dimensional stacked architecture. Components of different sizes and types can be arranged in vertical layers (first, second, and third component layers) rather than being constrained to a single planar layer, enabling both design flexibility and compact package dimensions through efficient use of the vertical dimension.
Data Source
AI summary
One or more stud bumps may form a conductive column to a component having back side metallization. In an embodiment, the column of stud bumps may be about 130 um vertically (Z-direction). Providing a microelectronics package with a column of stud bumps electrically connected to a component having back side metallization may provide a cost effective electrical interconnect and may enable the incorporation of components of different thicknesses, including that the component thicknesses are independent of each other, in a single fanout package, while providing a thin package profile and back side surface finish integration.