Fan-Out Package Structure Using Elliptical Columns Against Torque
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Solution Overview
Problem
Ensuring the reliability of integrated fan-out packages, which face challenges due to the compactness and complexity of their design, particularly in maintaining electrical connections and mechanical integrity under torque forces during encapsulation.
Innovation Solution
The use of elliptical columns and conical frustums as conductive structures, strategically arranged and oriented to resist torque forces, combined with the formation of ellipsoidal joint terminals, enhances the structural integrity and connectivity of the package, ensuring reliable electrical connections and mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive structures are used in integrated fan-out packages, then manufacturing is simpler, but reliability under torque forces during encapsulation deteriorates
Solution Approach 1:
The patent employs asymmetric conductive structures including elliptical columns and conical frustums with specific geometric parameters. These asymmetric shapes are strategically designed to resist torque forces generated during encapsulation, with the asymmetry providing mechanical advantage in counteracting rotational stresses while maintaining electrical connectivity functions
Solution Approach 2:
The patent utilizes curved and rounded conductive structures including elliptical columns and conical frustums with rounded tips. These curved geometries provide superior stress distribution and resistance to torque forces compared to sharp-edged structures, enhancing reliability during the encapsulation process while maintaining electrical conductivity
2Area of stationary object
If compact package design is implemented, then area utilization improves, but mechanical integrity under torque forces deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar conductive traces to three-dimensional conductive structures including elliptical columns and conical frustums. This dimensional escalation provides enhanced mechanical strength and torque resistance while maintaining compact footprint, as the vertical and radial dimensions of the 3D structures offer superior structural support within the same area
Solution Approach 2:
The patent employs composite conductive structures combining multiple materials with different properties. The conductive structures are formed with materials that provide both electrical conductivity and mechanical strength, creating a composite system that simultaneously achieves compact area utilization and enhanced mechanical integrity under torque forces
Data Source
AI summary
A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.