Fan-Out Semiconductor Package EMI Shielding
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Solution Overview
Problem
Existing semiconductor packages face challenges in effectively blocking electromagnetic interference (EMI) and heat dissipation, particularly in fan-out configurations, which can lead to increased noise radiation and design complexities due to the limitations of traditional EMI blocking methods such as shield cans.
Innovation Solution
The fan-out semiconductor package incorporates EMI blocking parts surrounding the semiconductor chip and redistribution layers, which are electrically connected to each other, providing continuous EMI blocking and heat dissipation through strategically designed first and second blocking parts, potentially reducing the need for additional shield cans and enhancing thermal characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional shield cans are used for EMI blocking, then EMI blocking is provided, but device complexity and design complexity increase
Solution Approach 1:
The patent combines multiple EMI blocking functions into a single integrated structure formed by the encapsulant material. The first and second blocking parts are merged with the encapsulant to form a unified EMI shielding structure that surrounds both the semiconductor chip and redistribution layer, eliminating the need for separate shield cans and reducing design complexity
Solution Approach 2:
The encapsulant material serves multiple functions simultaneously: it provides mechanical protection, thermal management, and EMI blocking. The blocking parts formed within the encapsulant perform both structural support and electromagnetic interference shielding, creating a multi-functional component that reduces overall device complexity
2Object-affected harmful factors
If shield cans are added for EMI blocking, then EMI shielding is improved, but the package structure becomes more complex
Solution Approach 1:
The patent merges the EMI blocking function with the existing encapsulant structure. The first blocking part surrounding the semiconductor chip and the second blocking part surrounding the redistribution layer are both formed as integral portions of the encapsulant, creating a simplified package structure without additional shield components
Solution Approach 2:
The blocking parts are nested within the encapsulant structure. The first blocking part is positioned within the encapsulant to surround the semiconductor chip, while the second blocking part is nested to surround the redistribution layer, creating a hierarchical nested arrangement that simplifies the overall package structure
Data Source
AI summary
A fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole of the first connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first connection member and the inactive surface of the semiconductor chip; and a second connection member disposed on the first connection member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The first connection member includes a first electromagnetic interference (EMI) blocking part surrounding side surfaces of the semiconductor chip, the second connection member includes a second EMI blocking part surrounding the redistribution layer, and the first EMI blocking part and the second EMI blocking part are connected to each other.