Fan-Out Semiconductor Packaging With Grooved Insulating Layer Alignment
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Solution Overview
Problem
Existing Fan-Out type semiconductor devices face misalignment issues between electrodes and conductors due to shrinkage of sealing resin during curing, leading to unreliable connections.
Innovation Solution
A semiconductor device design featuring a first insulating layer with recessed grooves and conductors with embedded and redistribution parts, where the conductors are formed using a thermosetting synthetic resin and metallic additives, and holes and grooves are created using a laser to ensure precise alignment and deposition of plating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor element is embedded into the sealing resin, then the device achieves size reduction and adaptability to various wiring patterns, but the sealing resin shrinkage during curing causes displacement of the semiconductor element and misalignment between electrodes and conductors
Solution Approach 1:
The patent applies preliminary action by forming the insulating layer with recesses before embedding the semiconductor element. These pre-formed recesses are designed to accommodate the expected displacement of the semiconductor element due to sealing resin shrinkage, ensuring that the electrodes will align with the conductors even after curing contraction occurs.
Solution Approach 2:
The patent changes the physical parameters of the insulating layer by creating recesses with specific depths and dimensions. These parameter modifications allow the insulating layer to compensate for the displacement caused by sealing resin shrinkage, maintaining alignment precision while enabling the semiconductor element to be embedded in the sealing resin for size reduction.
2Ease of manufacture
If openings are formed in the insulating layer using photolithography patterning, then conductors can be formed to connect to electrodes, but misalignment occurs between the openings and electrodes due to semiconductor element displacement
Solution Approach 1:
The patent performs preliminary action by pre-forming recesses in the insulating layer at the correct positions before conductor formation. This eliminates the need for high-precision photolithography patterning to achieve alignment, as the recesses already define the correct positions for conductor placement, simplifying the manufacturing process while ensuring precision.
Solution Approach 2:
The recesses in the insulating layer serve as an intermediary structure that mediates between the semiconductor element position and the conductor position. Even if the semiconductor element displaces, the recesses maintain the correct alignment relationship, acting as a buffer that decouples the positioning requirements.
3Device complexity
If the sealing resin is used to embed the semiconductor element, then the device achieves compact structure, but the curing shrinkage of the sealing resin causes displacement and reduces connection reliability
Solution Approach 1:
The patent applies local quality by creating localized recesses in the insulating layer at specific positions where alignment compensation is needed. Rather than modifying the entire insulating layer or sealing resin, the recesses are strategically placed only where electrode-conductor alignment is critical, maintaining connection reliability while preserving the compact embedded structure.
Solution Approach 2:
The patent uses preliminary action by pre-configuring the insulating layer with recesses before the semiconductor element is embedded and before the sealing resin cures. This anticipates the displacement that will occur during curing and pre-compensates for it, ensuring reliable connections are maintained throughout the manufacturing process and device operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents misalignment between electrodes and conductors, enhancing the reliability of the semiconductor device by allowing for precise positioning and efficient formation of conductive paths.
Implementation Method 1
forming with a laser in the insulating layer a plurality of holes that expose the electrodes and a plurality of grooves recessed from a surface of the insulating layer
Implementation Method 2
an insulating layer made of a material containing a thermosetting synthetic resin and an additive that contains a metallic element forming portions of the conductors
Data Source
AI summary
A semiconductor device includes an insulating layer, conductors, a semiconductor element and a sealing resin. The insulating layer has first and second surfaces opposite to each other in the thickness direction. Each conductor has an embedded part whose portion is embedded in the insulating layer and a redistribution part disposed at the second surface and connected to the embedded part. The semiconductor element has electrodes provided near the first surface and connected the embedded parts of the conductors. The semiconductor element is in contact with the first surface. The sealing resin partially covers the semiconductor element and is in contact with the first surface. The redistribution parts include portions outside the semiconductor element as viewed in the thickness direction. The insulating layer has grooves recessed from the second surface in the thickness direction. The redistribution parts are in contact with the grooves.