Fan-Out Semiconductor Package Heat Dissipation Layer
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Solution Overview
Problem
Fan-in semiconductor packages face challenges in heat dissipation and spatial limitations due to the need for all I/O terminals to be disposed inside the semiconductor chip, making them unsuitable for compact or high-pin-count applications, and they cannot be directly mounted on electronic device main boards without additional packaging.
Innovation Solution
A fan-out semiconductor package design with a heat dissipation layer embedded in the insulating layer, electrically insulated from signal lines, and connected to the ground line via vias, allowing for efficient heat dissipation without affecting signal integrity and enabling a compact, high-pin-count layout that can be directly mounted on main boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a fan-in semiconductor package is used, then all I/O terminals can be disposed inside the semiconductor chip, but the package size increases and heat dissipation becomes difficult
Solution Approach 1:
The patent transitions from a fan-in package architecture to a fan-out package architecture, where I/O terminals are redistributed from being confined within the chip footprint to extending beyond the chip boundaries. This dimensional redistribution allows the mounting area to be optimized while creating dedicated space for heat dissipation structures, effectively resolving the contradiction between compact area and heat management.
Solution Approach 2:
The package structure is segmented into distinct functional regions: a chip mounting region, an I/O terminal region extending outward, and a heat dissipation region. This segmentation allows each region to be optimized independently, enabling the heat dissipation layer to be positioned strategically without interfering with the compact chip mounting area.
2Temperature
If a heat dissipation layer is added to improve heat dissipation, then heat dissipation characteristics improve, but signal lines may be affected
Solution Approach 1:
The heat dissipation layer is positioned in specific regions where heat generation occurs, such as beneath or adjacent to high-power components, while maintaining electrical insulation from signal lines through dielectric materials. This localized placement ensures effective heat dissipation without compromising signal integrity, as the heat dissipation function is concentrated where needed rather than uniformly distributed across the entire package.
3Ease of manufacture
If fan-in package structure is used, then chip mounting is straightforward, but additional packaging is required and mounting flexibility is reduced
Solution Approach 1:
The fan-out package structure serves multiple functions simultaneously: it provides a mounting substrate for the chip, redistributes I/O terminals to extend beyond the chip footprint for enhanced connectivity options, and incorporates heat dissipation capabilities. This multi-functionality eliminates the need for additional separate packaging components, allowing direct mounting on various substrates including flexible circuits and rigid boards, thereby enhancing mounting flexibility and adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation characteristics and reduces the mounting area and electrical path length, making it suitable for premium applications like mobile processors without the need for additional packaging, thus addressing the limitations of fan-in packages.
Implementation Method 1
a first heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line
Implementation Method 2
a first connection via penetrating through the first insulating layer and connected to the first redistribution layer
Data Source
AI summary
A semiconductor package includes a connection structure including a first insulating layer, a first redistribution layer disposed on the first insulating layer, and a first connection via penetrating through the first insulating layer and connected to the first redistribution layer, a semiconductor chip disposed on the connection structure, an encapsulant covering at least a portion of the semiconductor chip, a second insulating layer disposed on the encapsulant, a second redistribution layer including a signal line disposed on the encapsulant, and a heat dissipation layer disposed on the encapsulant and electrically insulated from the signal line.