Fan-Out Package Structure Using Insulating Protrusions and Barrier Layers
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Solution Overview
Problem
The semiconductor industry faces challenges in efficiently fabricating integrated fan-out packages with complex redistribution circuit structures, particularly in ensuring reliable electrical connections and minimizing intermetallic compound formation, which affects package reliability and cost.
Innovation Solution
A process flow involving a carrier with a de-bonding layer and dielectric layer, die mounting, insulating material encapsulation, redistribution circuit formation, and barrier layer deposition to prevent intermetallic compound formation, integrated with conductive through vias and terminals, is used to create a reliable and cost-effective integrated fan-out package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging processes are used for integrated fan-out packages, then fabrication complexity and cost increase, but package reliability and electrical connectivity are compromised
Solution Approach 1:
The fabrication process is divided into distinct stages: forming insulating protrusions in the carrier, mounting dies, forming redistribution circuit structures with conductive layers, and creating through vias. This segmentation allows each step to be optimized independently while maintaining overall process reliability and reducing complexity through systematic organization.
Solution Approach 2:
Insulating protrusions are formed in the carrier substrate before die mounting and redistribution circuit formation. This preliminary action establishes a structured foundation that guides subsequent processing steps, ensures proper alignment, and prevents intermetallic compound formation at critical interfaces, thereby improving reliability without adding complexity to later stages.
2Reliability
If barrier layers are added to prevent intermetallic compound formation, then manufacturing steps increase, but electrical connection reliability improves
Solution Approach 1:
The barrier layer formation is merged with the redistribution circuit structure fabrication process. The same photolithography and deposition equipment used for creating conductive patterns is utilized to form barrier layers, eliminating the need for separate manufacturing steps and maintaining ease of manufacture while ensuring electrical connection reliability.
Solution Approach 2:
Barrier layers serve as intermediary structures between dissimilar metal layers in the electrical connections. These thin films prevent direct contact between incompatible metals that would form intermetallic compounds, thereby improving electrical connection reliability without significantly complicating the manufacturing process.
3Reliability
If redistribution circuit structures are formed with multiple conductive layers, then electrical connectivity improves, but intermetallic compound formation increases
Solution Approach 1:
Barrier layers are introduced as intermediary structures between adjacent conductive layers and between conductive layers and the carrier substrate. These barrier layers prevent direct interaction between dissimilar metals, eliminating intermetallic compound formation while maintaining the multi-layer conductive structure necessary for high electrical connectivity.
Solution Approach 2:
Barrier layers are selectively applied only at interfaces where intermetallic compound formation is a risk, such as between the carrier substrate and conductive layers, and between dissimilar metal layers. This localized application maintains electrical connectivity in conductive regions while preventing harmful reactions at critical interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability of integrated fan-out packages by reducing intermetallic compound formation and lowering fabrication costs, while simplifying the process and improving electrical connectivity.
Implementation Method 1
respectively forming a plurality of barrier layers in the plurality of openings
Implementation Method 2
a carrier having a dielectric layer thereon, wherein the dielectric layer has a die attach region and a peripheral region surrounding the die attach region
Data Source
AI summary
Provided is a package structure including a die; an electrically connecting structure having a die attach region and a peripheral region surrounding the die attach region, wherein the die is disposed on the electrically connecting structure within the die attach region; an insulating protrusion disposed in the peripheral region and extending in a thickness direction of the die; a conductive structure disposed on the electrically connecting structure and encapsulating the insulating protrusion, wherein the conductive structure is electrically coupled to the electrically connecting structure and the die; and a dielectric structure disposed on the electrically connecting structure and encapsulating the die and the conductive structure.