Fan-Out Package Layout for Uniform-Thickness Passive Integration
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving thinner profiles and reduced costs while integrating passive devices, particularly due to difficulties in batch processing components of varying heights.
Innovation Solution
The integration of passive devices, such as capacitors and inductors, is facilitated by forming them to a uniform thickness with the die, allowing for batch processing techniques like fan-out wafer level processing, which includes planarization and uniform encapsulation, followed by the formation of an integrated routing layer that can be processed in bulk, reducing costs and enabling finer pitch fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive devices are integrated into semiconductor packages, then device functionality is improved, but manufacturing complexity increases due to varying component heights
Solution Approach 1:
The patent changes the thickness parameter of passive devices to match the die thickness, enabling uniform batch processing. This parameter adjustment resolves the manufacturing complexity issue while preserving device functionality integration
Solution Approach 2:
The patent segments the manufacturing process into batch processing for uniformly thick components and selective thinning for passive devices. This segmentation allows standard batch techniques to be used while still accommodating varying component requirements
2Productivity
If batch processing techniques are used, then productivity is improved, but manufacturing precision deteriorates due to difficulty in processing components of varying heights
Solution Approach 1:
By standardizing the thickness parameter of passive devices to match the die thickness, the patent enables effective batch processing. This parameter uniformity allows batch techniques to achieve both high productivity and acceptable manufacturing precision
Solution Approach 2:
The patent applies preliminary planarization to passive devices before batch processing to establish uniform thickness. This preliminary action enables subsequent batch processing steps to proceed with adequate precision while maintaining high productivity
3Length of moving object
If passive devices are thinned to match die thickness, then device profile is improved, but manufacturing difficulty increases
Solution Approach 1:
The patent performs preliminary planarization on passive devices before thinning operations. This preliminary action creates a uniform starting surface that simplifies subsequent thinning processes and improves manufacturing ease while achieving the desired thin profile
Solution Approach 2:
The patent uses an intermediary planarization step between passive device formation and thinning operations. This intermediary process mediates the manufacturing difficulty by creating uniform surfaces that are easier to process in subsequent steps
Data Source
AI summary
A semiconductor device and method of including peripheral devices into a package is disclosed. In one example, a peripheral device includes a passive device such as a capacitor or an inductor. Examples are shown that include a peripheral device that is substantially the same thickness as a die or a die assembly. Examples are further shown that use this configuration in a fan out process to form semiconductor devices.