Fan-Out Package Substrate RDL Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional fan-out packaging processes are costly due to high costs of forming redistribution layers (RDLs) and require a temporary carrier for support, which also incurs additional costs and time, and are limited by reticle size for large package fabrication.
Innovation Solution
A package structure and manufacturing method that uses a substrate with a redistribution layer (RDL) structure of reduced size, where fine-pitch connectors on a die are connected to the RDL and coarse-pitch connectors to the substrate, reducing RDL layers and eliminating the need for a temporary carrier by using the substrate as a supporting carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional fan-out packaging process uses multiple redistribution layers (RDLs) to achieve electrical interconnection, then electrical interconnection and power integrity performance are improved, but manufacturing cost increases significantly
Solution Approach 1:
The patent segments the electrical interconnection function by using two distinct connection paths: fine-pitch connectors connect to the RDL structure for signal integrity, while coarse-pitch connectors connect directly to the substrate for power integrity. This segmentation allows each connection type to be optimized independently, reducing the need for multiple expensive RDL layers while maintaining both signal and power integrity performance.
2Strength
If conventional fan-out packaging process uses a temporary carrier for supporting the in-process structure, then structural support during manufacturing is improved, but manufacturing cost and time increase due to de-bonding process
Solution Approach 1:
The substrate serves a dual function: it provides the final electrical connection function and simultaneously serves as the supporting carrier during the packaging process. This self-service approach eliminates the need for a separate temporary carrier and its subsequent de-bonding process, reducing both manufacturing cost and time while maintaining structural support throughout manufacturing.
3Ease of manufacture
If current reticle size is limited, then conventional fabrication process is simpler, but fabrication of large size package becomes challenging
Solution Approach 1:
The patent applies local quality by creating a localized RDL structure only in the first area where fine-pitch connectors require it, while the second area uses direct substrate connections. This localized approach allows large package fabrication to proceed using standard reticle sizes for the majority of the substrate area, while only a small local region requires the more complex RDL structure, thus overcoming reticle size limitations.
4Device complexity
If RDL structure width is reduced to be less than substrate width, then manufacturing complexity and cost are reduced, but electrical interconnection coverage must be maintained
Solution Approach 1:
The patent segments the electrical interconnection function by using two distinct connection paths: fine-pitch connectors connect to the RDL structure for signal integrity, while coarse-pitch connectors connect directly to the substrate for power integrity. This segmentation allows each connection type to be optimized independently, reducing the need for multiple expensive RDL layers while maintaining both signal and power integrity performance.
Data Source
AI summary
A package structure and a method of manufacturing the same are provided. The package structure includes a substrate, a redistribution layer (RDL) structure, a first die, an encapsulant and a plurality of conductive terminals. The RDL structure is disposed on and electrically connected to the substrate. A width of the RDL structure is less than a width of the substrate. The first die is disposed on the substrate and the RDL structure. The first connectors of the first die are electrically connected to the RDL structure. The second connectors of the first die are electrically connected to the substrate. A first pitch of two adjacent first connectors is less than a second pitch of two adjacent second connectors. The encapsulant is on the substrate to encapsulate the RDL structure and the first die. The conductive terminals are electrically connected to the first die through the substrate and the RDL structure.