Fan-out Semiconductor Package Warpage Control

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Solution Overview

Problem

Fan-out semiconductor packages face challenges in controlling warpage, which affects their rigidity and uniformity, especially as they are miniaturized and thinned for compactness and thermal/electrical performance in electronic devices.

Innovation Solution

Incorporating a core member with through-holes and recess portions filled with encapsulant, which redistributes connection pads outwardly of the semiconductor chip, enhancing rigidity and allowing precise control of encapsulant volume to manage warpage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the semiconductor package is miniaturized and thinned for compactness, then the size is reduced, but warpage control becomes difficult

Engineering Contradiction:

Improvepackage sizeVSAvoidwarpage control

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The core member is divided into multiple recess portions (first, second, third recess portions) at different locations and depths, allowing localized adjustment of encapsulant volume to control warpage in different regions of the package

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different recess portions are formed with different depths and volumes to create localized variations in encapsulant distribution, enabling precise control of warpage in specific areas while maintaining overall package compactness

Inventive Principle:

Principle #3Local quality

2Stability of the object's composition

If the core member includes multiple recess portions with different volumes, then warpage is controlled, but manufacturing complexity increases

Engineering Contradiction:

Improvewarpage controlVSAvoidcore member structure

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The recess portions vary in depth and volume parameters, with the first recess portion having a greater volume than the second and third recess portions, allowing optimized warpage control through parameter adjustment rather than complex structural design

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10699996B2Fan-out semiconductor package

Publication Date: 2020.06.30 SAMSUNG ELECTRONICS CO LTD

AI summary

A fan-out semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole of the core member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant covering at least portions of the core member and the semiconductor chip and filling at least portions of the through-hole; and a connection member disposed on the core member and the active surface of the semiconductor chip and including a redistribution layer electrically connected to the connection pads. The core member has a recess portion penetrating through at least portions of the core member, and at least a portion of the recess portion is filled with the encapsulant.