Fan-Out Semiconductor Package With Identification Mark
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Solution Overview
Problem
Current semiconductor packages, such as fan-in packages, face challenges in accommodating a large number of I/O terminals and miniaturization due to spatial limitations, making it difficult to directly mount them on electronic device mainboards, and they often require separate interposer substrates for mounting.
Innovation Solution
A semiconductor package design featuring a fan-out structure with a connection structure that redistributes connection pads outwardly, allowing for a compact size and the use of standardized ball layouts, and includes a mark for identification information carved into the encapsulant to enhance visibility, with a transparent passivation layer and opaque or translucent resin encapsulant for visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If fan-in package structure is used, then spatial utilization is improved, but the number of I/O terminals and miniaturization capability deteriorate
Solution Approach 1:
The patent transitions from fan-in packaging to fan-out packaging, where connection pads are redistributed outwardly from the chip area to the package substrate. This dimensional redistribution allows I/O terminals to extend beyond the chip boundaries, increasing terminal capacity without increasing chip area, and enables direct mounting on mainboards with standardized ball layouts.
2Ease of manufacture
If conventional packaging is used, then manufacturing simplicity is maintained, but direct mounting capability on mainboards deteriorates
Solution Approach 1:
The fan-out package structure serves multiple functions: it provides compact packaging, enables direct mounting on mainboards through standardized ball layouts, eliminates the need for separate interposer substrates, and maintains ease of manufacturing through established redistribution layer techniques. The package becomes universally adaptable to different mounting scenarios.
3Illumination intensity
If opaque encapsulant is used, then visibility of internal structures deteriorates, but identification mark visibility improves
Solution Approach 1:
The patent applies different optical properties to different regions of the encapsulant: the encapsulant body is opaque to block light and provide a clean background for the identification mark, while the mark region itself is made visible through contrast. This local differentiation allows the mark to stand out clearly without requiring transparency of the entire encapsulant structure.
Data Source
AI summary
A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure, encapsulating the semiconductor chip, and including an opaque or translucent resin; a mark indicating identification information and carved in the encapsulant; and a passivation layer disposed on the encapsulant and including a transparent resin.