Fan-out Sensor Package with Through-Hole Mounting
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Solution Overview
Problem
Existing image sensor packages face limitations in miniaturization and performance improvement due to the use of wire bonding technology and the difficulty in directly mounting image sensors on main boards, leading to spatial constraints and inefficiencies in signal transfer.
Innovation Solution
A fan-out sensor package is developed, featuring a first interconnection member with a through-hole, a sensor with connection pads and microlenses, and a second interconnection member with redistribution layers that electrically connect the sensor, allowing for a shorter signal path and improved signal transfer, while also enabling miniaturization and reduced material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding technology is used to interconnect the image sensor and the printed circuit board, then the image sensor package can be manufactured using conventional methods, but the miniaturization and performance improvement of the image sensor package are limited
Solution Approach 1:
The patent extracts the image sensor from the conventional wire bonding process and directly mounts it onto the printed circuit board. This eliminates the need for separate wire bonding interconnection, thereby reducing the overall package size while maintaining manufacturability through direct mounting techniques
Solution Approach 2:
The patent transitions from a planar wire bonding interconnection method to a three-dimensional direct mounting approach. By stacking the image sensor directly onto the PCB in a vertical dimension, the package footprint is reduced while maintaining electrical connectivity, thus achieving miniaturization
2Volume of moving object
If the image sensor is directly mounted on the main board, then miniaturization can be achieved, but the difficulty in directly mounting image sensors on main boards creates spatial constraints
Solution Approach 1:
The patent introduces an intermediate substrate or adapter layer that facilitates the direct mounting of the image sensor onto the main board. This intermediary component provides mechanical support and electrical interconnection, thereby enabling miniaturization while overcoming the spatial constraints and mounting difficulties through a standardized interface
3Reliability
If conventional packaging methods are used, then the image sensor can be protected and connected, but the signal transfer path is long and performance improvement is limited
Solution Approach 1:
The patent extracts and eliminates the long signal transfer path inherent in conventional packaging methods. By directly mounting the image sensor onto the main board, the signal path is shortened from passing through multiple intermediate layers to a direct connection, thereby reducing signal transfer time while maintaining connection reliability through robust solder joints and optimized trace routing
Data Source
AI summary
A fan-out sensor package includes: a first interconnection member having a through-hole; a sensor disposed in the through-hole of the first interconnection member and having an active surface having connection pads and microlenses disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the first interconnection member and the active surface or the inactive surface of the sensor; and a second interconnection member disposed on the first interconnection member and the inactive surface or the active surface of the sensor. The first interconnection member and the second interconnection member include, respectively, redistribution layers electrically connected to the connection pads of the sensor. A camera module includes the fan-out sensor package.