Fan-Out Package Shielding Layer with Variable Degassing Holes
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Solution Overview
Problem
Fan-out semiconductor packages face challenges in achieving effective electromagnetic wave shielding and gas removal, particularly in compact designs with numerous pins, where existing technologies struggle to balance shielding efficiency with gas emission efficiency.
Innovation Solution
A fan-out semiconductor package design incorporating an electromagnetic wave shielding layer with varying densities of degassing holes, including regions with higher and lower hole densities, and potentially no holes, to optimize shielding and gas emission based on the component's electromagnetic wave emission and gas emission needs, connected by a metal layer and via through the encapsulant, and including a core member with a metal layer covering through holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic wave shielding layer is added to block electromagnetic waves, then electromagnetic wave shielding efficiency is improved, but gas removal capability deteriorates
Solution Approach 1:
The electromagnetic wave shielding layer is designed with regions of different hole densities: a first region with higher hole density for effective gas removal, and a second region with lower hole density for enhanced electromagnetic wave shielding. This local differentiation allows each region to optimize its function based on specific requirements.
Solution Approach 2:
The shielding layer is segmented into multiple functional regions (first region and second region) with distinct hole density characteristics. This segmentation enables simultaneous achievement of gas permeability in certain areas and electromagnetic wave blocking in other areas.
2Object-affected harmful factors
If the shielding layer is made more dense to improve electromagnetic wave blocking, then shielding efficiency is improved, but gas emission capability deteriorates
Solution Approach 1:
Different regions of the shielding layer have different hole densities tailored to their specific functions. The second region has lower hole density for superior electromagnetic wave shielding, while the first region has higher hole density for effective gas emission, resolving the contradiction between shielding density and gas emission capability.
3Reliability
If degassing holes are increased to improve gas removal, then gas emission capability is improved, but electromagnetic wave shielding efficiency deteriorates
Solution Approach 1:
The shielding layer is divided into regions with different hole densities. The first region contains more degassing holes to facilitate gas removal, while the second region has fewer holes to maintain electromagnetic wave shielding efficiency, thus resolving the contradiction between gas emission and shielding performance.
4Volume of moving object
If the package size is reduced to achieve compact design, then miniaturization is improved, but the ability to implement effective shielding and gas removal deteriorates
Solution Approach 1:
The shielding layer uses localized high-density and low-density regions to achieve both effective shielding and gas removal within a compact footprint. This allows the package to maintain small size while preserving the functionality of both shielding and degassing.
Solution Approach 2:
The patent introduces a dimensional aspect by varying hole density across different spatial regions of the shielding layer, allowing simultaneous optimization of shielding and gas removal functions within a compact two-dimensional plane.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high electromagnetic wave shielding efficiency while effectively removing gases from the package, enhancing the reliability and performance of compact semiconductor packages by optimizing degassing hole distribution and shielding layer structure.
Implementation Method 1
An effective electromagnetic wave shielding structure is required for the semiconductor package, since a problem may occur when electromagnetic waves affect the semiconductor chip
Implementation Method 2
an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes
Data Source
AI summary
A fan-out semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, an encapsulant encapsulating the semiconductor chip, and an electromagnetic wave shielding layer disposed on the semiconductor chip and including a plurality of degassing holes. The electromagnetic wave shielding layer includes a first region and a second region in which densities of the degassing holes are different from each other, the first region having a density of the degassing holes higher than a density of the degassing holes in the second region.