Fan-Out Packaging Shielding Structure With Grounded Side Connector
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Solution Overview
Problem
In fan-out wafer-level or board-level packaging, the thin high-density redistribution layer leads to high resistance when an electromagnetic shielding film is deposited, affecting the shielding effectiveness due to a small contact area between the conductive layer and the line layer.
Innovation Solution
A fan-out packaging structure with a redistribution layer including a grounding line layer, a plastic packaging layer, and a shielding layer, where an electrical connector is used to connect the shielding layer to the grounding line layer, providing a larger contact area and reducing resistance, and the structure includes a patterned metal line layer and dielectric layer with specific materials and configurations to enhance shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If an electromagnetic shielding film layer is deposited on side and back faces of a package with a thin high-density redistribution layer, then electromagnetic shielding is provided, but the contact area between the conductive layer and the line layer is small leading to high resistance
Solution Approach 1:
The patent introduces an electrical connector as an intermediary component between the shielding film layer and the grounding line layer. This connector provides a larger contact area and lower resistance path compared to direct deposition on the thin redistribution layer. The connector acts as a mediator that bridges the shielding function and the grounding function while overcoming the resistance problem caused by the thin substrate.
Solution Approach 2:
Instead of relying solely on the planar contact area on the thin redistribution layer, the patent extends the connection into the vertical dimension by using through-substrate connectors or elevated connector structures. This dimensional transition allows the connector to make contact with both the shielding layer and the grounding layer with sufficient contact area, bypassing the limitation of the thin substrate's surface area.
2Productivity
If the high-density redistribution layer is made thinner to achieve higher integration, then packaging density is improved, but the contact area for electromagnetic shielding connection is reduced
Solution Approach 1:
The patent transitions from two-dimensional planar contact on the thin redistribution layer to three-dimensional connector structures that extend vertically. This allows the connectors to achieve sufficient contact area with both the shielding layer and grounding layer without being constrained by the reduced surface area of the thinned substrate, thereby maintaining both high packaging density and adequate contact area.
Solution Approach 2:
The electrical connector serves as a mediator that decouples the relationship between substrate thickness and contact area. By introducing this intermediate component, the system can maintain thin substrate for high density while the connector provides the necessary contact area independently of the substrate thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the shielding effect by reducing resistance and allowing effective shielding of electromagnetic waves across different frequency ranges, while being cost-effective and suitable for large-scale industrial manufacturing.
Implementation Method 1
the bottom of the body member is cladded with the conductive filler and is electrically connected to the grounding line layer
Implementation Method 2
the first shielding layer at least partially covers a side surface of the plastic packaging layer... the first shielding layer and the grounding line layer are electrically conductive to each other
Data Source
AI summary
The present invention provides a fan-out packaging structure and a manufacturing method thereof. The packaging structure includes a redistribution layer, at least one plastic packaging layer, at least one first shielding layer, at least one chip, and at least one electrical connector. The redistribution layer includes a grounding line layer, and the chip and the electrical connector are disposed on a first face of the redistribution layer and are electrically connected to the redistribution layer; the plastic packaging layer encapsulates the electrical connector and the chip; the first shielding layer at least covers a side face of the plastic packaging layer; and the electrical connector is at least partially exposed to the side face of the plastic packaging layer and electrically connected to the first shielding layer.