Fan-out semiconductor package with stacked components in through-hole
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Solution Overview
Problem
The existing fan-in semiconductor packages face challenges in miniaturization and thickness due to spatial limitations and the need for direct mounting on main boards, which is difficult for semiconductor chips with a large number of I/O terminals or compact sizes, and require interposer substrates for proper mounting.
Innovation Solution
A fan-out semiconductor package design that includes a first connection member with a through-hole, multiple components disposed in a stacked form within the through-hole, and redistribution layers on the second and third connection members, allowing for electrical connections and redistribution of I/O terminals outside the semiconductor chip, enabling miniaturization and thinness without the need for interposer substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If fan-in semiconductor package is used, then direct mounting on main board is possible, but package size and thickness cannot be reduced due to spatial limitations
Solution Approach 1:
The patent transitions from planar connection terminal arrangement to three-dimensional stacked component arrangement within through-holes. Multiple components are disposed vertically in the through-hole of the connection member, utilizing the vertical dimension to increase functional density without increasing package footprint, thereby enabling miniaturization while maintaining mounting capability
Solution Approach 2:
The patent implements nesting by placing multiple components (first component, second component, third component) inside the through-hole of the connection member. This nested configuration allows multiple functional elements to occupy the same spatial envelope, reducing overall package size while maintaining all necessary functions for direct board mounting
2Area of moving object
If semiconductor chip size is reduced, then compactness is improved, but number of I/O terminals that can be implemented is limited
Solution Approach 1:
The patent redistributes connection terminals from a two-dimensional planar arrangement on the chip surface to a three-dimensional vertical arrangement through the through-hole structure. Connection terminals are extended outwardly from the chip region through the stacked components, enabling increased I/O terminal count within a reduced chip area by utilizing the vertical dimension for terminal routing
3Adaptability or versatility
If interposer substrate is added for mounting, then mounting of compact chips is enabled, but package complexity and size increase
Solution Approach 1:
The connection member serves multiple functions simultaneously: it provides mechanical support for the stacked components, establishes electrical connections through its conductive structure, enables thermal dissipation pathways, and facilitates direct mounting on the main board without requiring a separate interposer substrate. This multi-functionality reduces package complexity by eliminating the need for additional interposer layers
4Volume of moving object
If multiple components are stacked in through-hole, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by pre-forming the through-hole structure with precise dimensional tolerances and positioning features before component assembly. The connection member is designed with predetermined hole dimensions, positioning structures, and alignment features that guide the placement of stacked components, ensuring accurate alignment is achieved during assembly without requiring extremely high precision manufacturing of each individual component
Data Source
AI summary
A fan-out semiconductor package includes: a first connection member having a through-hole; a first component disposed in the through-hole; a second component disposed in the through-hole and attached to the first component; an encapsulant filling at least portions of spaces between walls of the through-hole and side surfaces of the first component and side surfaces of the second component; a second connection member disposed on the first connection member and the first component; and a third connection member disposed on the first connection member and the second component. A number of at least one of the first or second components is plural, the second and third connection members are connected to each other through the first connection member, and the first connection member includes a redistribution layer electrically connected to a redistribution layer of the second connection member and a redistribution layer of the third connection member.