Dimensionally-Constrained Faraday Cage Using Thermal Module Frame
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Solution Overview
Problem
Dimensionally-constrained devices with heat generating components face challenges in efficiently cooling these components while providing effective electromagnetic shielding, particularly in thin form factors, where traditional designs are bulky, costly, and complex, and often damage thermal modules during disassembly.
Innovation Solution
A dimensionally-constrained shielded circuit board assembly that employs a thermal module with a frame and fence forming a Faraday cage, where the gasket seals between the frame and fence, eliminating the need for a lid, allowing for thinner designs, reduced complexity, and easier assembly/disassembly, while maintaining effective RF shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If traditional electromagnetic shielding designs are used, then RF shielding effectiveness is improved, but device thickness and complexity increase
Solution Approach 1:
The patent combines the RF shielding function with the existing structural components (circuit board fence and thermal module frame) to form a integrated Faraday cage. The circuit board's ground plane and vertical fences, together with the thermal module's conductive frame, create a unified shielding structure that eliminates the need for separate shielding components, thereby reducing device thickness while maintaining RF shielding effectiveness.
Solution Approach 2:
The conductive frame of the thermal module serves multiple functions: it provides thermal conduction for heat dissipation, structural support for the thermal module, and RF shielding as part of the Faraday cage. This multi-functionality eliminates the need for dedicated shielding components, reducing overall device complexity and thickness.
2Object-affected harmful factors
If traditional electromagnetic shielding designs are used, then RF shielding effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the RF shielding function with existing structural and thermal management components. The circuit board's ground plane and fences, combined with the thermal module's conductive frame, form a unified Faraday cage structure. This integration eliminates the need for separate shielding components, reducing component count and device complexity while maintaining shielding effectiveness.
Solution Approach 2:
Existing components are designed to serve multiple functions: the circuit board fence provides both structural support and RF shielding, while the thermal module frame provides both thermal conduction and shielding. This multi-functionality reduces the overall component count and simplifies the device structure.
3Stability of the object's composition
If thermal modules are secured with lids in traditional designs, then thermal module positioning is improved, but thermal module damage during disassembly occurs
Solution Approach 1:
The patent removes the traditional lid component from the thermal module assembly. Instead of using a lid to secure the thermal module, the design relies on the conductive frame and gasket system that provides both positioning and protection. This extraction of the lid eliminates the source of thermal module damage during disassembly while maintaining proper thermal module positioning through the frame structure.
Solution Approach 2:
The patent divides the securing function into separate components: the conductive frame provides structural positioning, while the gasket provides sealing and electrical connection. This segmentation allows the thermal module to be secured without a lid, preventing damage during disassembly while maintaining stable positioning through the distributed support of the frame and gasket system.
4Length of moving object
If thin form factor designs are implemented, then device thickness is reduced, but heat dissipation effectiveness deteriorates
Solution Approach 1:
The patent combines the thermal conduction path with the RF shielding structure. The conductive frame of the thermal module serves as both the shielding element and the thermal management pathway. This integration ensures efficient heat dissipation through the frame while maintaining the thin form factor, as no additional thermal management components are required beyond the integrated frame structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient heat dissipation and RF shielding in thinner devices, accommodating dimensional variations, reducing component count, and enhancing repairability by maintaining thermal module integrity during assembly/disassembly, thus achieving high performance with reduced z-dimension thickness and cost.
Implementation Method 1
the gasket creates a bias between the fence and the frame that contributes to blocking radio frequency energy between the fence and the frame to complete a Faraday cage around the heat generating component
Implementation Method 2
The heat generating components are also shielded from ambient radio frequency energy (RF shielding) that can degrade their performance
Data Source
Figure 1
Figure 2A
Figure 2B~2C
AI summary
The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.