Faraday Shield Slice Layout for Lower Eddy Current Losses
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Solution Overview
Problem
Existing semiconductor plasma etching technologies face inefficiencies in RF power utilization, leading to suboptimal plasma density and productivity in semiconductor manufacturing processes.
Innovation Solution
A semiconductor processing apparatus with a Faraday shield featuring conductive slices and spacers to minimize eddy current losses, optimizing RF power efficiency by reducing the thickness and arranging conductive slices discontinuously to enhance magnetic field generation and plasma density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a continuous conductive shield is used to block electromagnetic fields, then shielding effectiveness is improved, but eddy current losses increase and RF power efficiency deteriorates
Solution Approach 1:
The continuous conductive shield is divided into multiple discrete conductive slices arranged in an annular pattern. These slices are separated by insulating gaps that prevent eddy current circulation while maintaining electromagnetic field shielding effectiveness. Each slice is electrically isolated from adjacent slices, breaking the continuous conductive path that causes eddy current losses.
Solution Approach 2:
Insulating materials or gaps are introduced between adjacent conductive slices to prevent electrical continuity. These intermediaries block eddy current formation while allowing the shield to maintain its electromagnetic shielding function. The insulating gaps act as mediators that reconcile the conflicting requirements of shielding effectiveness and energy efficiency.
2Quantity of substance
If RF power is increased to improve plasma density, then plasma density increases, but energy consumption increases and process cost increases
Solution Approach 1:
The invention converts the previously harmful eddy current losses into beneficial effects by eliminating them through slice segmentation. The reduced energy losses are redirected to enhance plasma generation efficiency, achieving higher plasma density at lower RF power levels. The insulating gaps between slices transform from simple separators into active elements that improve overall system efficiency.
3Object-affected harmful factors
If shield thickness is increased to improve shielding effectiveness, then electromagnetic field blocking is improved, but eddy current losses increase and device complexity increases
Solution Approach 1:
Rather than increasing the thickness of a continuous shield, the invention segments the shield into multiple thin conductive slices. This segmentation approach achieves equivalent or superior shielding effectiveness while reducing overall material usage and structural complexity. The annular arrangement of slices provides efficient electromagnetic field blocking without requiring thick continuous conductive barriers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves RF power efficiency, resulting in higher plasma density and increased productivity in semiconductor manufacturing processes by reducing eddy current losses and enhancing magnetic field generation.
Implementation Method 1
a coil surrounding the plasma-generating chamber and coupled to a power source
Implementation Method 2
minimize eddy current losses, optimizing RF power efficiency by reducing the thickness and arranging conductive slices discontinuously
Data Source
AI summary
A Faraday shield, a semiconductor processing apparatus, and an etching apparatus are provided. The Faraday shield includes a plurality of conductive slices and a spacer interposed between adjacent two of the conductive slices to electrically isolate the adjacent two of conductive slices from one another. The conductive slices are separately arranged aside one another and oriented along a circumference of the Faraday shield. A coil is wound around the circumference of the Faraday shield.