Multi-Section Faraday Shielding for Uniform Plasma Cleaning
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Solution Overview
Problem
Existing Faraday shielding devices in plasma processing systems face issues of high manufacturing costs, complex installation, and spatial occupancy due to capacitive connections, which complicate the installation and positioning of components.
Innovation Solution
A multi-section Faraday shielding device with electrically conductive petal-shaped assemblies and connecting capacitors, where the electrode plates are integrated with the conductive plates and dielectric layer, allowing for simpler installation and reduced vertical space occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If capacitive connection is used to divide Faraday into sections, then RF distribution becomes consistent and cleaning becomes even, but the Faraday structure occupies more vertical space and increases installation complexity
Solution Approach 1:
The patent combines the capacitor and Faraday plate into a single integrated component where the capacitor is formed directly on the Faraday plate surface. This merging eliminates the need for separate capacitor assemblies and complex capacitive connections, thereby reducing installation complexity while maintaining the multi-section RF distribution benefits for uniform cleaning.
Solution Approach 2:
The patent transitions from a vertical stacking arrangement (occupying vertical space) to a planar integration approach where capacitors are formed on the surface of the Faraday plate. This dimensional change from three-dimensional vertical occupation to two-dimensional surface integration reduces the vertical space requirement and simplifies the overall structure.
2Manufacturing precision
If capacitive connection is used to divide Faraday into sections, then RF distribution becomes consistent, but the upper surface becomes uneven and radio frequency coil installation becomes difficult
Solution Approach 1:
By integrating the capacitor directly onto the Faraday plate surface, the patent creates a unified structure with a flat upper surface. This eliminates the need for separate capacitor assemblies that would create surface irregularities, thereby facilitating easy installation of the radio frequency coil while maintaining consistent RF distribution through the integrated capacitor design.
3Volume of moving object
If thin dielectric layer is used for capacitor, then device size is reduced, but manufacturing cost increases due to high precision requirements
Solution Approach 1:
The patent employs a sputtering process to form the dielectric layer, where the Faraday plate itself serves as the substrate for capacitor formation. This self-service approach eliminates the need for separate, precision-manufactured thin dielectric components, thereby reducing manufacturing complexity and cost while achieving the required compact size.
4Adaptability or versatility
If Faraday plate and capacitor are installed separately, then flexibility is improved, but positioning and installation become extremely difficult
Solution Approach 1:
The patent integrates the capacitor directly onto the Faraday plate, creating a single pre-assembled unit. This eliminates the need for separate installation and positioning operations, thereby improving ease of operation during installation while maintaining the flexibility benefits of modular Faraday section design through the integrated capacitor structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces processing costs, simplifies installation, and ensures even voltage distribution across the dielectric window, enhancing the cleaning efficiency of the plasma processing system.
Implementation Method 1
a connecting capacitor is provided between every two adjacent electrically conductive plates; each connection capacitor includes an upper electrode plate and a lower electrode plate
Implementation Method 2
a lower end surface of the upper electrode plate and/or an upper end surface of the lower electrode plate are provided with an insulating coating
Data Source
AI summary
A Faraday shielding device includes an electrically conductive ring and a plurality of electrically conductive petal-shaped assemblies radially and symmetrically on the periphery of the electrically conductive ring. Each electrically conductive petal-shaped assembly includes a plurality of electrically conductive plates and connecting capacitors; the electrically conductive plate are at intervals along the radial direction; a connecting capacitor is between every two adjacent electrically conductive plates. Each connection capacitor includes upper and lower electrode plates, the lower end surface of each upper electrode plate and/or the upper end surface of each lower electrode plate has an insulating coating, the lower end surface of the upper electrode plate is connected to the upper end surface of the lower electrode plate, the upper electrode plate is electrically connected to one of the adjacent electrically conductive plate, and the lower electrode plate is electrically connected to the other of the adjacent electrically conductive plates.