FBG Sensor Package with Low-Modulus Resin for Detection Stability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensor packages with FBG sensors suffer from reduced detection accuracy due to stress relaxation in the resin portion caused by cure shrinkage and aging, affecting the initial value of the detection system.
Innovation Solution
A sensor package design where the FBG sensor is in contact with a resin portion and held by a bonding adhesive layer, with a resin portion having an elastic modulus less than 1.0×10^7 Pa, and a bonding adhesive layer cured at room temperature, allowing for improved detection accuracy and durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a resin portion with high elastic modulus is used in the sensor package, then structural strength is improved, but stress relaxation occurs due to cure shrinkage and aging, causing wavelength shift and reducing detection accuracy
Solution Approach 1:
The patent changes the elastic modulus parameter of the resin portion to less than 1.0×10^7 Pa, which is a specific quantitative parameter change. This lower elastic modulus reduces the resin's tendency to undergo stress relaxation during curing and aging, thereby minimizing wavelength shifts in the FBG sensor while still providing sufficient structural support for the sensor package.
Solution Approach 2:
The patent employs a composite structure consisting of the resin portion, bonding adhesive layer, and FBG sensor. This composite design allows the resin portion to provide a stable, low-stress environment for the FBG sensor while the bonding adhesive layer ensures firm attachment to the object, achieving both structural integrity and measurement precision.
2Strength
If the bonding adhesive layer is cured at elevated temperature to improve bonding strength, then attachment strength is improved, but the complexity of the curing process increases and may affect the resin portion's stability
Solution Approach 1:
The patent changes the curing temperature parameter to room temperature for the bonding adhesive layer. This parameter change simplifies the curing process by eliminating the need for elevated temperature equipment and complex temperature control systems, while still achieving sufficient bonding strength and maintaining the stability of the resin portion and FBG sensor.
3Stability of the object's composition
If the resin portion is made too rigid to maintain structural integrity, then structural stability is improved, but cure shrinkage and aging cause stress relaxation that affects the FBG sensor's initial value
Solution Approach 1:
The patent changes the elastic modulus parameter of the resin portion to less than 1.0×10^7 Pa, creating a more flexible material that can accommodate cure shrinkage and aging without generating significant stress. This parameter change maintains structural stability while preserving the FBG sensor's initial value accuracy.
Solution Approach 2:
The resin portion acts as an intermediary between the FBG sensor and the external environment. By using a resin with appropriate elastic modulus, it mediates the stresses from curing and aging, protecting the FBG sensor from stress relaxation while still providing structural support and environmental isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances detection accuracy and durability, enabling reliable outdoor use with improved workability and firm bonding to the object.
Implementation Method 1
a bonding adhesive layer located on a surface of the resin portion on a side opposite to the first base material, and the FBG sensor portion of the optical fiber is in contact with the resin portion and held by the bonding adhesive layer
Data Source
AI summary
A sensor package attached to an object contains a first base material; and an optical fiber having an FBG sensor portion disposed on the first base material. The sensor package includes a resin portion located on the first base material, a first adhesive layer located on the first base material to attach the first base material to the object, and a bonding adhesive layer located on a surface of the resin portion on a side opposite to the first base material, and the FBG sensor portion of the optical fiber is in contact with the resin portion and held by the bonding adhesive layer.