Open Heat Spreader FCBGA Package With TIM-Free Thermal Path
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Solution Overview
Problem
Current semiconductor devices face limitations in thermal management due to the use of thermal interface materials (TIMs) which increase manufacturing complexity and costs, and result in a thicker package height, necessitating improved thermal characteristics for handling increased thermal energy generated by densely integrated components.
Innovation Solution
The implementation of an open heat spreader design with a thermally conductive material, such as copper or steel, featuring openings to accommodate semiconductor die and other components, and filled with a thermally conductive material to enhance thermal energy transfer, eliminating the need for a TIM and reducing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal interface materials (TIMs) are used to transfer thermal energy from semiconductor die, then thermal management is achieved, but manufacturing complexity and costs increase, and package height increases
Solution Approach 1:
The patent removes the thermal interface material (TIM) layer from the thermal management structure. Instead of using TIM to transfer heat from the semiconductor die, the invention directly couples the die to the heat spreader through a thermally conductive substrate, eliminating the intermediate TIM layer and its associated manufacturing complexity
Solution Approach 2:
The patent merges the substrate and heat spreader into an integrated thermally conductive structure. The substrate itself is made thermally conductive and serves as both the mounting platform for the semiconductor die and the heat transfer path to the heat spreader, combining multiple functions into a single integrated component
2Temperature
If thermal interface materials (TIMs) are used to transfer thermal energy from semiconductor die, then thermal management is achieved, but package height increases
Solution Approach 1:
The patent removes the TIM layer from the vertical stack, directly eliminating the height contribution of this intermediate material layer. The semiconductor die is mounted directly to the thermally conductive substrate without the additional TIM thickness
Solution Approach 2:
By merging the substrate and heat spreader functions into an integrated structure, the patent eliminates the need for separate TIM layers between these components, thereby reducing the overall vertical dimension of the package while maintaining thermal management functionality
3Temperature
If traditional TIM-based solutions are used, then thermal energy transfer is achieved, but manufacturing complexity and costs increase
Solution Approach 1:
The patent eliminates the TIM application process from the manufacturing sequence. Without TIM, there are no steps for TIM deposition, curing, or alignment, simplifying the manufacturing process and reducing associated costs
Solution Approach 2:
The integration of substrate and heat spreader functions reduces the number of discrete components and assembly steps. The thermally conductive substrate serves dual purposes as both mechanical support and thermal pathway, eliminating the need for separate TIM application and reducing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal conductivity by directly connecting the semiconductor die to the heat spreader through a conductive layer, reducing package thickness and manufacturing complexity while maintaining effective thermal management, thus addressing the limitations of traditional TIM-based solutions.
Implementation Method 1
The implementation of an open heat spreader design with a thermally conductive material, such as copper or steel, featuring openings to accommodate semiconductor die and other components, and filled with a thermally conductive material to enhance thermal energy transfer
Data Source
AI summary
A semiconductor device has a heat spreader with an opening formed through the heat spreader. The heat spreader is disposed over a substrate with a semiconductor die disposed on the substrate in the opening. A thermally conductive material, e.g., adhesive or an elastomer plug, is disposed in the opening between the heat spreader and semiconductor die. A conductive layer is formed over the substrate, heat spreader, and thermally conductive material.