FCCSP Heat Dissipation Using Die Attach Film Instead of a Metal Lid
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Solution Overview
Problem
Conventional flip-chip chip scale packages (FCCSPs) are bulky and expensive due to the inclusion of a metal lid for heat dissipation, which also increases manufacturing time and costs.
Innovation Solution
The implementation of a semiconductor package design that eliminates the metal lid by using a die attach film or thermally conductive paste coupled to the non-device side of the semiconductor die, which is exposed to the exterior and promotes heat dissipation through a metal layer or thermally conductive paste, reducing bulk and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal lid is used for heat dissipation in conventional FCCSPs, then heat dissipation is effective, but the package becomes bulky and manufacturing time increases
Solution Approach 1:
The patent extracts and eliminates the metal lid component from the conventional FCCSP structure. Instead of using a separate metal lid for heat dissipation, the invention uses the die attach film itself as the thermal management solution, thereby removing the bulky metal lid while maintaining heat dissipation functionality.
Solution Approach 2:
The die attach film is given multiple functions: it serves both as an adhesive to attach the die to the substrate and as a thermal management component for heat dissipation. This eliminates the need for separate metal lid components, reducing package bulk while maintaining effective heat dissipation.
2Temperature
If a metal lid is used for heat dissipation, then heat dissipation is effective, but manufacturing cost and complexity increase
Solution Approach 1:
The patent removes the metal lid assembly and its associated curing process from the manufacturing sequence. By using the die attach film as the primary thermal management solution, the invention eliminates complex multi-step assembly and curing operations, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The patent merges the adhesive function and thermal management function into a single component (the die attach film). This consolidation eliminates the need for separate metal lid assembly and curing processes, thereby reducing manufacturing complexity and time.
3Temperature
If a metal lid is used for heat dissipation, then heat dissipation is effective, but manufacturing time increases
Solution Approach 1:
The patent extracts and eliminates the metal lid assembly and curing process from the manufacturing sequence. By using the die attach film as the thermal management solution, the invention removes time-consuming assembly and curing steps, thereby reducing manufacturing time and increasing throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a less bulky and cost-effective FCCSP with reduced manufacturing time, increasing throughput by eliminating the lid assembly and curing process, while maintaining effective heat dissipation through the die attach film or thermally conductive paste.
Implementation Method 1
a die attach film or thermally conductive paste coupled to the non-device side of the semiconductor die, which is exposed to the exterior and promotes heat dissipation
Data Source
AI summary
In examples, a semiconductor package comprises a substrate including a conductive layer; a conductive pillar coupled to the conductive layer; and a semiconductor die having first and second opposing surfaces. The first surface is coupled to the conductive pillar. The package also includes a die attach film abutting the second surface of the semiconductor die and a metal layer abutting the die attach film and having a metal layer surface facing away from the die attach film. The metal layer surface is exposed to an exterior of the FCCSP. The package includes a mold compound layer covering the substrate.