FCM Chiplet Test Circuit for Heterogeneous Interoperability

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Solution Overview

Problem

Current chiplet technologies face challenges in testability due to poor versatility and scalability of existing design for testability, particularly in heterogeneous chip systems with different manufacturers' test requirements and specifications, limiting interoperability and flexibility in testing.

Innovation Solution

A flexible configurable module (FCM) based chiplet test circuit with a two-way skew-symmetric design structure, incorporating a control signal configuration module and a test state control module, allows for simplified test configuration and enhanced controllability, enabling horizontal dual-line transmission and vertical bidirectional transmission modes, thus addressing the limitations of existing designs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If traditional IEEE 1149.1, IEEE 1500, or IEEE 1687 standards are used for chiplet testability design, then test coverage can be achieved, but the circuits have poor expandability and universality, making them completely inapplicable to heterogeneous chip testing under advanced packaging

Engineering Contradiction:
Improveversatility of test circuitVSAvoidcomplexity of test configuration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent designs a universal test access structure based on FCM that can accommodate heterogeneous chiplets from different manufacturers. The FCM interface includes standardized ports (TI, TO, SI, SO, TCK, TMS, TRST) that provide multi-functional test capabilities across different chip types and packaging technologies (2.5D, 3D), replacing manufacturer-specific test interfaces

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The test circuit is segmented into modular FCM units, each with independent test functionality. Each FCM can be independently configured and tested, allowing the overall test system to be built by combining multiple identical modular units, which improves versatility while maintaining manageable complexity through standardization

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple bare chips from different manufacturers are integrated in one chiplet package, then heterogeneous functionality is achieved, but different manufacturers have different test requirements and specifications, reducing interoperability

Engineering Contradiction:
Improveinteroperability between different chipsVSAvoidcomplexity of test specification integration
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies homogeneity by providing all chiplets with identical FCM interface structures, regardless of their internal heterogeneity. The standardized interface ensures uniform test access methods across diverse chiplets, enabling interoperability through consistent test signal routing and control mechanisms

Inventive Principle:
Principle #33Homogeneity

Solution Approach 2:

The FCM acts as an intermediary layer between the heterogeneous chiplets and the external test equipment. It provides a standardized interface that mediates between different manufacturers' test requirements and the universal test system, translating diverse chip-specific test needs into a common test protocol

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of operation

If existing design for testability circuits are used, then basic test functionality is provided, but they lack flexibility and controllability for complex heterogeneous chiplet systems

Engineering Contradiction:
Improveflexibility of test configurationVSAvoidtest accuracy for heterogeneous chips
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The FCM incorporates dynamic controllability through control signals (TE, TOE, SIE, SOE) that can dynamically switch the operational state of each FCM. This allows the test system to flexibly activate or deactivate specific FCMs based on test requirements, improving ease of operation while maintaining reliable test accuracy through precise control

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS12099086B2FCM based chiplet test circuit
Publication Date: 2024.09.24 NANJING UNIV OF POSTS & TELECOMM INST AT NANJING CO LTD
  • US12099086B2 patent drawing
  • US12099086B2 patent drawing
  • US12099086B2 patent drawing

AI summary

The present disclosure relates to the field of design for testability of super-large-scale integrated circuits, and discloses a flexible configurable module (FCM) based chiplet test circuit. The core structure of the circuit is located at an interposer. The test circuit includes FCMs, a control signal configuration module and a test state control module, where the FCM adopts a two-way skew-symmetric structure to implement data transmission in the horizontal direction and the vertical direction; the control signal configuration module is connected to control signals of all the FCMs, so as to control the data transmission directions as well as switch on and switch off states of all the FCMs; and the test state control module controls the shift and update operations of data inside the FCMs and the control signal configuration module.