FDM 3D Printer Head Integrating Pick-and-Place for Embedded Electronics
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Solution Overview
Problem
Conventional 3D printing methods, such as FDM, face challenges in incorporating electronic components directly into printed objects without complicating the production process or requiring additional steps for assembly, especially when aiming for integrated electronic components like LEDs.
Innovation Solution
The method involves using pre-configured filaments with embedded electronic components, such as LEDs, which are assembled upstream of the printer nozzle, allowing for simultaneous printing of the filament and electronic components without the need for separate printer heads or post-processing assembly, enabling full embedding of electronic devices within the 3D printed object.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are incorporated directly into 3D printed objects using conventional FDM methods, then integration of electronic components is achieved, but production process complexity increases and additional assembly steps are required
Solution Approach 1:
The patent merges the electronic component placement function with the FDM printing process by integrating a pick-and-place mechanism directly into the printer head. This allows electronic components to be picked up and placed onto the printed object during the same operational cycle, eliminating separate assembly steps and reducing production process complexity while maintaining component integration capability
Solution Approach 2:
The printer head is designed with multi-functionality, combining both the material extrusion function and the electronic component placement function. The same printer head performs both FDM printing and pick-and-place operations, reducing the need for additional specialized equipment and simplifying the overall production system
2Adaptability or versatility
If separate printer heads are used for printing and electronic component placement, then electronic components can be embedded, but device complexity and cost increase
Solution Approach 1:
The patent implements a universal printer head that performs both material extrusion and electronic component placement functions. The printer head is equipped with both the extrusion mechanism for FDM printing and a pick-and-place mechanism for component placement, allowing a single head to accomplish tasks that would traditionally require separate specialized heads
Solution Approach 2:
The patent combines the pick-and-place mechanism with the FDM extrusion system in a single integrated printer head assembly. This merging of functions allows the system to print and place electronic components simultaneously using one head, avoiding the need for multiple separate printer heads and reducing overall device complexity
3Ease of manufacture
If post-processing assembly is used for electronic components, then production steps are separated, but manufacturing time and complexity increase
Solution Approach 1:
The patent enables continuous operation by performing both FDM printing and electronic component placement in a single uninterrupted process. The pick-and-place mechanism operates during the same cycle as material extrusion, eliminating idle time and sequential waiting that would occur with separate post-processing assembly steps
Solution Approach 2:
The pick-and-place mechanism is prepared and positioned in advance within the printer head, allowing electronic components to be picked up and placed during the printing process itself. This preliminary preparation of the placement mechanism enables simultaneous operation with material extrusion, eliminating the need for separate post-processing assembly steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the integration of electronic components into 3D printed objects, reducing production complexity and enabling the creation of objects with embedded electronic components like LEDs without the need for additional assembly steps, while maintaining the efficiency of FDM printing.
Implementation Method 1
FDM works on an 'additive' principle by laying down material in layers; a plastic filament or metal wire is unwound from a coil and supplies material to produce a part. Possibly, (for thermoplastics for example) the filament is melted and extruded before being laid down.
Implementation Method 2
In general, FDM printers use a thermoplastic filament, which is heated to its melting point and then extruded, layer by layer, (or in fact filament after filament) to create a three dimensional object.
Implementation Method 3
the filament is melted and extruded before being laid down
Data Source
AI summary
A method for manufacturing a 3D item (10) comprising an electronic component (40), wherein the method comprises the step of printing with a fused deposition modeling (FDM) 3D printer (500) 3D printable material (201) to provide said 3D item (10), wherein the 3D printable material (201) comprises said electronic component (40). The fused deposition modeling (FDM) 3D printer comprises a printer nozzle, and the method further comprises the steps of providing upstream of the printer nozzle a filament of 3D printable material, wherein the filament comprises a cavity for hosting the electronic component, and creating upstream of the printer nozzle an assembly of the filament and the electronic component.