Semiconductor Treatment Liquid Fe Ion Corrosion Control
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Solution Overview
Problem
Current treatment liquids for semiconductor devices often corrode metal layers during residue removal, leading to performance issues and defects due to inadequate anticorrosion and residue removal properties.
Innovation Solution
A treatment liquid comprising an oxidizing agent, a corrosion inhibitor, water, and iron (Fe) at specific ratios, which effectively inhibits metal layer corrosion and enhances residue removal while minimizing defect generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional treatment liquids are used for residue removal, then residue removing property is improved, but metal layer corrosion increases
Solution Approach 1:
The patent introduces Fe ions as an intermediary substance that mediates between the treatment liquid and the metal layer. The Fe ions form a protective complex with the corrosion inhibitor, creating an intermediary protective layer that prevents direct contact between the corrosive treatment liquid and the metal layer, thereby reducing corrosion while maintaining residue removal capability
Solution Approach 2:
The patent changes the chemical parameters of the treatment liquid by adding Fe ions and controlling the ratio of corrosion inhibitor to Fe ions. This parameter change transforms the treatment liquid from a corrosive solution to a controlled chemical environment where Fe ions modulate the reactivity, enabling effective residue removal without excessive corrosion
2Object-affected harmful factors
If treatment liquid composition is optimized for anticorrosion, then metal layer protection is improved, but residue removing property deteriorates
Solution Approach 1:
The patent optimizes the concentration ratio of corrosion inhibitor to Fe ions within a specific range (10^-10 to 10^-4 by mass ratio). This precise parameter control ensures that enough Fe ions are present to form protective complexes for corrosion resistance, while maintaining sufficient oxidizing capability through the oxidizing agent to remove residues effectively
Solution Approach 2:
The treatment liquid forms a composite chemical system consisting of oxidizing agent, corrosion inhibitor, Fe ions, and water. This composite composition synergistically combines the corrosion protection function (from Fe-ion-corrosion inhibitor complexes) with the residue removal function (from oxidizing agent), achieving both objectives simultaneously
3Quantity of substance
If treatment liquid is applied for residue removal, then residue removing property is improved, but defect generation increases
Solution Approach 1:
Fe ions serve as an intermediary that prevents direct harsh interaction between the treatment liquid and the substrate. This intermediary role reduces the formation of defects by moderating the chemical environment, allowing effective residue removal without causing substrate damage or particle adhesion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The treatment liquid provides excellent anticorrosion protection and residue removal capabilities, reducing defects and ensuring the desired performance of semiconductor devices.
Implementation Method 1
a treatment liquid for a semiconductor device, comprising: an oxidizing agent; a corrosion inhibitor; water, and Fe
Implementation Method 2
the anticorrosion property of a metal layer was good
Data Source
AI summary
A treatment liquid is a treatment liquid for a semiconductor device containing an oxidizing agent, a corrosion inhibitor, water, and Fe, in which the content ratio of the Fe to the oxidizing agent is 10−10 to 10−4 in terms of mass ratio.